FCBGA Packaging Jet Underfill Dispenser CUF Inline Cnc Glue Dispenser ISO

FCBGA Packaging CUF Application Inline Jet Underfill Dispenser

The GS600 Series Inline Jet Underfill Dispenser is Mingseal’s next-generation solution engineered specifically for FCBGA encapsulating applications, where process stability, ultra-fine dispensing paths, and precise glue control are critical to yield and performance.

Built for high-reliability semiconductor production, the GS600 integrates an advanced piezo jetting module, real-time glue weight calibration, and a triple low-level alarm module—ensuring zero unexpected downtime in demanding mass production lines.

A key advantage for CPU packaging is the ability to strictly limit flow height to less than 70% of the chip’s sidewall while keeping keep-out zones (KOZ) under 250 μm. Combined with a precision visual alignment system and repeatable dot accuracy within ±25µm, the GS600 ensures minimal overflow and high fill uniformity.

Core Advantages

• Industry-Leading KOZ Control: Ensure that glue stays within tight keep-out zones, with KOZ consistently <250μm.
• Height-Controlled Capillary Flow: Specialized jetting and flow management maintain the capillary rise below 70% of the die height.
• Precision Glue Weight & Path Control: Keep volume variation within ±3% with single-dot position repeatability down to ±25µm.
• Reliable Low-Level Monitoring: Reduce process interruption risk and improve material changeover efficiency.

Typical Applications

✔ FCBGA (CPU) Underfill
✔ Flip Chip CPU Die Attach Protection
✔ High-Density BGA Packages
✔ Fine-Pitch Flip Chip Bonding
✔ Capillary Fill for High-Performance Microprocessors

Technical Specifications

FAQ

Q1: How does the GS600 control KOZ below 250μm?
A: Our proprietary path planning and flow control algorithms precisely confine glue spread, while high-resolution jetting and vision alignment minimize lateral flow beyond the intended area.

Q2: How do you ensure the flow does not climb too high?
A: By combining precision piezo jetting with advanced temperature control and bottom heating, the GS600 consistently limits the fill height to <70% of die height.

Q3: What about glue weight consistency?
A: Real-time inline glue weight inspection keeps glue output stable within ±3% while dot placement holds repeatability within ±25μm.

Q4: How is downtime minimized?
A: The GS600 includes a triple low-level alarm, integrated MES traceability, and smart syringe status detection, ensuring material runs are predictable and uninterrupted.

About Mingseal

As a trusted leader in high-precision dispensing, Mingseal provides cutting-edge inline and desktop systems for semiconductor, electronics, and precision optics industries. With deep process expertise, global support teams, and a commitment to smart manufacturing, we help advanced packaging factories achieve higher yield, lower cost, and stable quality—from CPU to SiP, BGA, and beyond.

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technology solutions for industry-leading customers in the fields of semiconductor packaging & testing and precision electronic manufacturing, jointly promoting industry technique and technology progress.

Mingseal Technology specializes in the development and production of high-precision dispensing machines, which are widely used in advanced semiconductor packaging, consumer electronics, and automotive electronics manufacturing. Our dispensing systems feature visual control, multi-axis motion, and adaptable configurations, enabling consistent and efficient material application in complex processes.

Our products are trusted by top-tier customers across industries, and our business and technical support network spans China, Japan, South Korea, Vietnam, Singapore, India, Thailand, Malaysia, and Mexico.

Mingseal Technology has received multiple national honors and qualifications, including National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise, and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, we will continue to invest in technological R&D, uphold values of cooperation and sharing, and work closely with customers, suppliers, employees, and partners to advance high-end intelligent manufacturing.