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| Categories | Advanced Packaging Equipment | 
|---|---|
| Brand Name: | Mingseal | 
| Model Number: | GS600DD | 
| Certification: | ISO CE | 
| Place of Origin: | China | 
| MOQ: | 1 | 
| Price: | $28000-$150000 / pcs | 
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union | 
| Delivery Time: | 5-60 Days | 
| Packaging Details: | Wooden Case | 
| Dimensions: | 770×1650×2100mm | 
| Dispensing range: | 355mm×595mm | 
| Footprint: | 770×1650×2100mm | 
| Camera view: | 35×35mm | 
| Company Info. | 
| Changzhou Mingseal Robot Technology Co., Ltd. | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
Dual-Valve AD/TIM Glue Dispensing System for Lid Attach Processes
The GS600 series is an advanced dual-valve inline dispensing system
purpose-built to handle demanding AD (Adhesive Dispensing) and TIM
(Thermal Interface Material) applications in lid attach processes
for high-end semiconductor packaging.
In modern CPU or GPU manufacturing, ensuring precise and void-free
bonding between die and lid is critical for thermal management and
mechanical protection. The GS600 series makes this possible by delivering highly accurate, repeatable glue paths for both structural adhesives and thermal interface materials in a
single pass.
Its dual-valve architecture enables synchronous dispensing, allowing manufacturers to apply different materials sequentially or simultaneously. The system’s machine vision module automatically identifies the workpiece position, aligns the nozzle height, and generates a precise glue path to meet strict lid attach specifications.
Core Advantages
Typical Applications
✓ Lid attach station for CPU/GPU packaging
✓ Adhesive bonding for metal lids and heat spreaders
✓ TIM layer deposition for advanced thermal management
✓ Void-free underfill or dam & fill bonding processes
✓ Multi-material bonding in semiconductor assembly
Technical Specifications
| Transmission System | Dimensions | 770×1650×2100mm | 
| Transmission system | X/Y: Linear motor Z: Servo motor&Screw module | |
| Repeatability (3sigma) | X/Y: ±5 μm Z: ±10 μm | |
| Positioning accuracy (3sigma) | X/Y: ±10 μm Z: ±25 μm | |
| Max. movement speed | X/Y:1300mm/s Z: 500mm/s | |
| Max. accelerated velocity | X/Y:1.3g Z:0.5g | |
| Dispensing range | 355mm×595mm | |
| Grating resolution | 1 μm | |
| Visual repetitive matching accuracy | 5μ m | |
| Adhesive single-point position accuracy | ≤±30 μ m | |
| Laser sensor accuracy | ±1 μ m | |
| Applicable syringe type | 5cc, 10cc,30cc,50cc,70cc | |
| Glue weight accuracy | 10mg±3%,5mg±5% | |
| Weighing module accuracy | 220g/0.1mg | |
| Vision Module | Pixel | 500W (2048×2448dpi) | 
| Lens | 0.2X telecentric lens | |
| Camera view | 35×35mm | |
| Single pixel accuracy | 17um | |
| Glue width detection | ≥ 170um | |
| Angle correction capability of the secondary valve relative to the main valve | 0-180° (7 ×7mmWorkpiece) | |
| 0-3° (110×110mmWorkpiece) | ||
| Shooting method | Positioning shot/fly shot | |
| Facilities | Ambient temp. & humidity | 25℃±5℃ , 30 ~ 70% | 
| Footprint W× D × H | 770×1650×2100mm (w/o Loading & Unloading) | 
FAQ
Q1: How does GS600 series ensure uniform TIM and adhesive coverage?
A: Its machine vision auto-tracking, laser height detection, and
synchronous dual-valve operation deliver precise path control and
volume repeatability.
Q2: Can I switch between screw and piezo jetting valves?
A: Absolutely. The GS600 series supports both valve types, allowing
you to handle high-viscosity structural adhesives and low-viscosity
thermal pastes on the same line.
Q3: Is it suitable for high-volume production?
A: Yes. The system is designed for inline integration in
semiconductor factories, with robust cabinet build quality, FFU
filtration, and real-time monitoring to ensure stable output.
Q4: Can it integrate with upstream and downstream automation?
A: Yes. The GS600 series is compatible with MES, glue tank
scanners, and auto loaders/unloaders for seamless inline operation.
About Mingseal
Mingseal is a trusted partner for precision fluid dispensing
solutions serving global semiconductor, MEMS, optical, and
electronics industries. With decades of experience, we help
manufacturers improve yield, reduce cycle time, and meet the
tightest tolerances for next-generation microelectronic packaging.
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