SC SC2331 RGB Rolling Shutter Camera Sensor Module 1920x1080 For Drones

SC SC2331 RGB Rolling Shutter Camera Module , Machine Vision , Biometrics , QR Code , Customization Services Available .

1. Basic Parameters:

- Resolution: 1920(H)×1080(V), 2MP. It supports high-definition image output and meets various high-definition imaging requirements.

- Pixel Size: 2.45μm(H)×2.45μm(V). Equipped with optimized pixel technology, it effectively increases light intake and improves image quality, preserving more image details especially in low-light environments.

- Optical Format: 1/3.2 inch. Featuring strong compatibility, it can be flexibly matched with various lenses to satisfy installation and imaging needs of different scenarios.

- Supply Voltage: Core voltage 1.2V, interface voltage 1.8V, analog voltage 2.8V. It can operate stably under various voltage conditions and ensure sensor reliability.

- Temperature Range: Operating temperature ranges from -30℃ to 85℃. The wide operating temperature range enables adaptation to diverse working environments.

2. Technical Features:

- Rolling Shutter Technology: Adopts a progressive exposure rolling shutter design with low imaging noise and delicate detail restoration. It features high circuit integration, lower power consumption and cost, ideal for high-definition imaging in static and low-speed scenarios.

- It integrates upgraded DSI-2 technology and Pro series core technologies, combined with SFC Pixel® technology and ultra-low noise readout circuit. It greatly enhances low-light imaging performance and noise suppression capability, delivering clear and pure images even in dim environments. Meanwhile, optimized color processing technology improves color reproduction for authentic and delicate color presentation.

- Features Pin-to-Pin compatible design, enabling seamless upgrade of full-level products, reducing the cost and difficulty of product upgrading and improving iteration efficiency. It adopts 35pin CSP packaging with a compact size of only 5.36mm×3.35mm. The miniature form factor facilitates integration into various miniaturized devices, saves internal space, and fits the design demands of miniaturized and lightweight products.

- SC2331 Camera Module: Compatible with standard modules with different lens configurations such as 137°, to meet diversified customer demands.

3. Application Fields:

Widely applied in biometric recognition, drones, smart home, IoT devices, machine vision, barcode scanning, factory automation and other fields.

4. Personalized Customization Services:

Custom modules can be produced tailor-made according to customer requirements, delivering personalized products that fully meet customized demands.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.