OV OV2775 RGB Rolling Shutter Camera Sensor Module For Biometric Recognition

OV OV2775 RGB Rolling Shutter Camera Module , Machine Vision , Biometrics , QR Code , Customization Services Available .

1. Basic Parameters:

- Resolution: 1920 (H) × 1080 (V), 2MP, supporting full HD resolution to meet high-definition imaging requirements.

- Pixel Size: 2.8µm(H) × 2.8µm(V). Adopting OmniBSI™-2 Deep Well™ pixel technology, it lays a solid foundation for high dynamic range and low-light performance, and effectively improves the clarity and fineness of image acquisition.

- Optical Format: 1/2.9 inch, compatible with various lens specifications with the chief ray angle of the lens up to 15°, satisfying imaging demands in diverse scenarios.

- Supply Voltage: Core voltage 1.2V, interface voltage 1.8V, analog voltage 1.8V. It can operate stably under various voltage conditions and ensure sensor reliability.

- Temperature Range: Operating temperature ranges from -40℃ to 105℃. It features a wide operating temperature range and can adapt to various working environments.

2. Technical Features:

- Rolling Shutter Technology: Designed with line-by-line exposure rolling shutter, it delivers low imaging noise and exquisite detail restoration. It also boasts high circuit integration, lower power consumption and cost advantages, ideal for high-definition imaging in static and low-speed scenarios.

- Supported by OmniBSI™-2 Deep Well™ pixel technology, it achieves a dynamic range of 94dB with single exposure and outputs 16-bit linear signals without HDR combination artifacts and signal-to-noise ratio degradation. It supports dual-exposure mode to expand the dynamic range to over 120dB. The secondary ultra-short exposure greatly reduces motion artifacts, making it suitable for complex imaging scenarios with alternating strong and weak light.

- It owns high sensitivity and excellent low-light performance. Equipped with RGB Bayer color filter, it supports image processing functions including lens correction, defective pixel elimination and automatic black level correction to greatly optimize imaging quality. Adopting compact chip-scale packaging, it is small in size and easy to be integrated into various devices.

- OV2775 Camera Module: Compatible with standard modules with different lens configurations such as 74° to meet diversified customer demands.

3. Application Fields:

It is widely applied in biometric recognition, unmanned aerial vehicles, smart home, IoT devices, machine vision, barcode scanning, factory automation and other fields.

4. Personalized Customization Services:

Custom modules can be produced in a tailored manner according to customer requirements to create exclusive products that fully match clients' actual needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.