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| Categories | HDI Printed Circuit Board |
|---|---|
| Material: | FR4 |
| Minimum Hole Size: | 0.1 mm |
| Minimum Line Spacing: | 0.075 mm |
| Supply Ability: | 1 Million Square feet/per month |
| Board Thickness: | 1.2mm |
| Copper Thickness: | 1/1/1/1/1/1/1/1 oz |
| Model Number: | XSWPCB |
| Price: | Negotiable |
| Minimum Line Width: | 0.05 mm |
| Certification: | UL ,IOS9000 |
| Brand Name: | XSW PCB |
| Place of Origin: | China |
| Payment Terms: | Western Union |
| MOQ: | 1 |
| Delivery Time: | 8-15DAYS |
| Layer Count: | 8-Layer |
| Company Info. |
| Shenzhen Xunsiwei Circuit Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This product is tailor-made for industrial PLC automation control systems, delivering a reliable and smooth human-machine interaction (HMI) operating experience while providing a comprehensive application solution.
| Layer Count | 8-Layer |
| Material | FR4 |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.05 mm |
| Minimum Line Spacing | 0.075 mm |
| Solder Mask Color | Green |
| Surface Finish | OSP |
| Application Field | High-Density Interconnect |
Product Description
High-Density Interconnect (HDI) Technology
High-Density Interconnect (HDI) utilizes microvias with a diameter of ≤0.15 mm, employing advanced fine-line patterning and microvia formation techniques to achieve interconnection of components within an ultra-compact form factor. Its architectural design — characterized by minimized conductor geometries and optimized layer stacking — enables a wiring density that is an order of magnitude higher than that of conventional printed circuit boards (PCBs), making it essential for high-performance miniaturized systems.
Electrical performance is significantly enhanced through precise control of parasitic effects: residual stub inductance is reduced, discrete decoupling capacitors are eliminated via integrated power/ground planes, and crosstalk is minimized through controlled impedance routing. Furthermore, through the strategic placement of thin HDI dielectric layers, radiated electromagnetic interference (RFI/EMI) is lowered by minimizing loop inductance and uniformly distributing capacitance, thereby optimizing signal integrity along high-frequency transmission paths.
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm | <30mm: ±0.03mm 30~60mm: ±0.05mm |
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