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10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision Electronics

Categories	HDI Printed Circuit Board
Model Number:	XSWPCB
Material:	FR-4
MOQ:	1
Delivery Time:	8-15DAYS
Surface Finish:	Immersion Gold (ENIG)
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month
Certification:	UL ,IOS9000
Board Thickness:	1.0mm (Customizable)
Place of Origin:	China
Copper Thickness:	1/1/1/1/1/1/1/1/1/1oz
Price:	Negotiable
Brand Name:	XSW PCB
Layer Count:	10-Layer

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Shenzhen Xunsiwei Circuit Co., Ltd.

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10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision Electronics

10 Layer High-Density Interconnect PCB with Blue Solder Resist for Precision Electronics

Custom 10 Layer 1+N+1 HDI PCB with Blue Solder Mask and ENIG Finish is engineered for high-density electronic applications requiring reliable blind-via interconnections, excellent solderability, and superior manufacturing consistency. Featuring a 10-layer stack-up combined with first-order HDI technology, the PCB provides enhanced routing capability and optimized signal integrity for advanced electronic devices.

Key Specifications

Layer Count	10-Layer
Material	FR-4
Board Thickness	1.0 mm (Customizable)
Copper Thickness	1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Blue
Surface Finish	Immersion Gold (ENIG)

Product Description

10-Layer 1+N+1 HDI Structure

Advanced multilayer PCB design with first-order HDI technology.
Optimized routing density and signal transmission performance.
Suitable for compact, high-performance electronic products.

High Blind-Via Yield Control

Laser-drilled blind vias with strict process management.
No stub residue permitted at blind-via bottoms.
Ensures stable electrical connectivity and long-term reliability.

Advanced Desmear Process

Complete resin removal after laser drilling.
Backlight inspection grade ≥ Level 9.
Improves metallization quality and via reliability.

Premium Blue Solder Mask Technology

Industry-standard blue solder resist with excellent appearance.
Optimized for fine-line circuit manufacturing.
Provides strong environmental and chemical resistance.

Low-Viscosity Ink Process

Special low-viscosity solder mask formulation.
Enhanced coating uniformity across high-density structures.
Reduces risk of incomplete development.

Precision Screen Printing Control

Printing pressure maintained between 4–6 kg/cm².
Prevents ink penetration into microvias and drilled holes.
Ensures accurate solder mask definition.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

Product Tags:

10 Layer High Density Interconnect PCB

Electronics High Density Interconnect PCB

10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision Electronics

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