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| Categories | High Frequency PCB |
|---|---|
| Brand Name: | Bicheng Enterprise Limited |
| Model Number: | BIC-0095-V2.4 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD 2.88-6.99 per piece |
| Payment Terms: | T/T, Paypal |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 4-5 working days |
| Packaging Details: | Vacuum |
| Number of Layers: | 2 |
| Glass Epoxy: | RO3003 |
| Final height of PCB: | 0.8mm ±0.1 |
| Final foil external: | 1 oz |
| Surface Finish: | Immersion gold 0.025µm over 3µm Nickel |
| Solder Mask Color: | Gloss Green |
| Colour of Component Legend: | White |
| Test: | 100% Electrical Test prior shipment |
Rogers 3003 PCB RO3003 High Frequency PCB 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Silver and Tin
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today we’re talk about RO3003 high frequency PCBs.
RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.
Let’s see some more features and applications.
1. low dielectric loss, DF=0.001, it can be used in applications up to 77 GHz.
2. Stable dielectric constant versus temperature and frequency, it’s ideal material for band pass filters, microstrip patch antennas, and voltage controlled oscillators.
3. excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.
4. Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.
5. low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.
Our PCB Capability (RO3003)
| PCB Material: | Ceramic-filled PTFE composite |
| Designator: | RO3003 |
| Dielectric constant: | 3.0 ±0.04 (process) |
| 3.0 (design) | |
| Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
| 30mil (0.762mm), 60mil (1.524mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
RO3003 high frequency PCBs are available with double sided, multi-layer and hybrid construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm, maximum size 400 by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.
Typical Applications
1. Automotive radar applications
2. GPS Antennas
3. Power amplifiers and antennas
4. Patch antennas for wireless communications
5. Direct broadcast satellite
The basic colour of RO3003 PCB is white.
The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.
Should you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix: Data Sheet of RO3003
| RO3003 Typical Value | |||||
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06 0.07 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 930 823 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.9 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 17 16 25 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
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