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| Categories | High Temperature PCB |
|---|---|
| Brand Name: | Bicheng Technologies Limited |
| Model Number: | BIC-507-V0.62 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD 2.99-9.99 PER PIECE |
| Payment Terms: | T/T, Western Union |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 10 working days |
| Packaging Details: | Vacuum |
| Number of Layers: | 2 |
| Glass Epoxy: | IT-180ATC |
| Final foil: | 1.0 Oz |
| Final height of PCB: | 1.6 mm ±10% |
| Surface Finish: | Immersion gold |
| Solder Mask Color: | Green |
| Colour of Component Legend: | White |
| Test: | 100% Electrical Test prior shipment |
High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.
Applications
Automotive (Engine room ECU)
Backplanes
Data Storage
Server and Networking
Telecommunications
PCB Parameters
| Item | Description | Requirement | Actual | Result |
| 1. Laminate | Material Type | FR-4 IT-180ATC | FR-4 IT-180ATC | ACC |
| Tg | 170℃ | 170℃ | ACC | |
| Supplier | ITEQ | ITEQ | ACC | |
| Thickness | 1.6±10% mm | 1.63-1.68mm | ACC | |
| 2.Plating thickness | Hole Wall | ≥25µm | 26.51µm | ACC |
| Outer copper | 35µm | 41.09µm | ACC | |
| Inner Copper | ||||
| 3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D | TAIYO/ PSR-2000GT600D | ACC |
| Color | Green | Green | ACC | |
| Rigidity (Pencil Test) | ≥4H or above | 5H | ACC | |
| S/M Thickness | ≥10 µm | 20.11µm | ACC | |
| Location | Both Sides | Both Sides | ACC | |
| 4. Component Mark | Material Type | TAIYO/ IJR-4000 MW300 | IJR-4000 MW300 | ACC |
| Color | White | White | ACC | |
| Location | C/S | C/S | ACC | |
| 5. Peelable Solder Mask | Material Type | |||
| Thickness | ||||
| Location | ||||
| 6. Identification | UL Mark | YES | YES | ACC |
| Date Code | WWYY | 2121 | ACC | |
| Mark Location | Solder Side | Solder Side | ACC | |
| 7. Surface Finish | Method | Immersion Gold | Immersion Gold | ACC |
| Tin Thickness | ||||
| Nickel Thickness | 3-6µm | 4.06µm | ACC | |
| Gold Thickness | 0.05µm | 0.056µm | ACC | |
| 8. Normativeness | RoHS | Directive 2015/863/EU | OK | ACC |
| REACH | Directive 1907 /2006 | OK | ACC | |
| 9.Annular Ring | Min. Line Width (mil) | 5mil | 4.8mil | ACC |
| Min. Spacing (mil) | 5mil | 5.2mil | ACC | |
| 10.V-groove | Angle | 30º | 30º | ACC |
| Residual thickness | 0.4±0.1mm | 0.43mm | ACC | |
| 11. Beveling | Angle | |||
| Height | ||||
| 12. Function | Electrical Test | 100% PASS | 100% PASS | ACC |
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC |
| Visual Inspection | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | |
| Warp and Twist | ≦0.7% | 0.21% | ACC | |
| 14. Reliability Test | Tape Test | No Peeling | OK | ACC |
| Solvent Test | No Peeling | OK | ACC | |
| Solderability Test | 265 ±5℃ | OK | ACC | |
| Thermal Stress Test | 288 ±5℃ | OK | ACC | |
| Ionic Contamination Test | ≦ 1.56 µg/c㎡ | 0.56µg/c㎡ | ACC |
Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075;
NPTH±0.05
| Hole Code | PTH | Required | Actual value | Result | |||
| 1 | Y | 0.400 | 0.400 | 0.425 | 0.425 | 0.400 | ACC |
| 2 | Y | 0.450 | 0.450 | 0.500 | 0.475 | 0.450 | ACC |
| 3 | Y | 0.600 | 0.600 | 0.650 | 0.625 | 0.600 | ACC |
| 4 | Y | 0.725 | 0.750 | 0.775 | 0.775 | 0.750 | ACC |
| 5 | Y | 0.850 | 0.850 | 0.825 | 0.850 | 0.825 | ACC |
|
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