| Sign In | Join Free | My carsrow.com | 
 | 
| Categories | High Temperature PCB | 
|---|---|
| Brand Name: | Bicheng Technologies Limited | 
| Model Number: | BIC-505-V0.45 | 
| Certification: | UL | 
| Place of Origin: | China | 
| MOQ: | 1 | 
| Price: | USD 2.99-9.99 PER PIECE | 
| Payment Terms: | T/T, Western Union | 
| Supply Ability: | 45000 pieces per month | 
| Delivery Time: | 10 working days | 
| Packaging Details: | Vacuum | 
| Number of Layers: | 6 | 
| Glass Epoxy: | S1000-2M | 
| Final foil: | 1.5 Oz | 
| Final height of PCB: | 1.6 mm ±10% | 
| Surface Finish: | HASL LF | 
| Solder Mask Color: | Green | 
| Colour of Component Legend: | White | 
| Test: | 100% Electrical Test prior shipment | 
High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil; and layer 4 at 7mil/7mil and 6mil/7mil track/gap. It is made on high performance and low CTE FR-4 S1000-2M. It’s 6-layer board with 1 oz copper each layer, coating with hot air soldering level (HASL) and green solder mask. It’s supplied by individual board with V-cut. 25 boards are packed for shipment.
Applications
Computers
Communications
Automotive electronics etc.

PCB Parameters
| Item | Description | Requirement | Actual | Result | 
| 1. Laminate | Material Type | FR-4 S1000-2M | FR-4 S1000-2M | ACC | 
| Tg | 170℃ | 170℃ | ACC | |
| Supplier | SHENGYI | SHENGYI | ACC | |
| Thickness | 1.6±10% mm | 1.63-1.68mm | ACC | |
| 2.Plating thickness | Hole Wall | ≥25µm | 30.17µm | ACC | 
| Outer copper | 35µm | 41.09µm | ACC | |
| Inner Copper | 30µm | 33.69µm | ACC | |
| 3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D | TAIYO/ PSR-2000GT600D | ACC | 
| Color | Green | Green | ACC | |
| Rigidity (Pencil Test) | ≥4H or above | 5H | ACC | |
| S/M Thickness | ≥10 µm | 20.11µm | ACC | |
| Location | Both Sides | Both Sides | ACC | |
| 4. Component Mark | Material Type | TAIYO/ IJR-4000 MW300 | IJR-4000 MW300 | ACC | 
| Color | White | White | ACC | |
| Location | C/S | C/S | ACC | |
| 5. Peelable Solder Mask | Material Type | |||
| Thickness | ||||
| Location | ||||
| 6. Identification | UL Mark | YES | YES | ACC | 
| Date Code | WWYY | 0421 | ACC | |
| Mark Location | Solder Side | Solder Side | ACC | |
| 7. Surface Finish | Method | HASL Lead Free | HASL Lead Free | ACC | 
| Tin Thickness | 3-6µm | 4.06µm | ACC | |
| Nickel Thickness | ||||
| Gold Thickness | ||||
| 8. Normativeness | RoHS | Directive 2015/863/EU | OK | ACC | 
| REACH | Directive 1907 /2006 | OK | ACC | |
| 9.Annular Ring | Min. Line Width (mil) | 6mil | 5.8mil | ACC | 
| Min. Spacing (mil) | 5mil | 5.2mil | ACC | |
| 10.V-groove | Angle | |||
| Residual thickness | ||||
| 11. Beveling | Angle | |||
| Height | ||||
| 12. Function | Electrical Test | 100% PASS | 100% PASS | ACC | 
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | 
| Visual Inspection | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | |
| Warp and Twist | ≦0.7% | 0.21% | ACC | |
| 14. Reliability Test | Tape Test | No Peeling | OK | ACC | 
| Solvent Test | No Peeling | OK | ACC | |
| Solderability Test | 265 ±5℃ | OK | ACC | |
| Thermal Stress Test | 288 ±5℃ | OK | ACC | |
| Ionic Contamination Test | ≦ 1.56 µg/c㎡ | 0.56µg/c㎡ | ACC | 
Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075;
NPTH±0.05
| Hole Code | PTH | Required | Actual value | Result | |||
| 1 | Y | 0.375 | 0.375 | 0.400 | 0.400 | 0.375 | ACC | 
| 2 | Y | 0.500 | 0.500 | 0.550 | 0.525 | 0.525 | ACC | 
| 3 | Y | 0.7*2.4 | 0.7*2.4 | 0.7*2.41 | 0.69*2.4 | 0.7*2.4 | ACC | 
| 4 | Y | 0.625 | 0.625 | 0.600 | 0.625 | 0.600 | ACC | 
| 5 | Y | 0.725 | 0.725 | 0.725 | 0.750 | 0.725 | ACC | 
| 6 | Y | 0.900 | 0.925 | 0.900 | 0.900 | 0.900 | ACC | 
| 7 | Y | 1.000 | 1.000 | 0.950 | 0.975 | 1.000 | ACC | 
| 8 | N | 1.050 | 1.050 | 1.050 | 1.075 | 1.050 | ACC | 
| 9 | Y | 1.300 | 1.300 | 1.300 | 1.325 | 1.325 | ACC | 
| 10 | Y | 1.350 | 1.350 | 1.325 | 1.350 | 1.325 | ACC | 
| 11 | Y | 1.575 | 1.575 | 1.600 | 1.600 | 1.575 | ACC | 
| 12 | Y | 1.650 | 1.650 | 1.700 | 1.675 | 1.675 | ACC | 
| 13 | Y | 1.700 | 1.700 | 1.750 | 1.725 | 1.725 | ACC | 
| 14 | Y | 3.250 | 3.250 | 3.250 | 3.275 | 3.250 | ACC | 
| 15 | Y | 3.450 | 3.450 | 3.400 | 3.425 | 3.450 | ACC | 
| 16 | Y | 0.7*2.6 | 0.7*259 | 0.7*2.61 | 0.69*2.6 | 0.7*2.59 | ACC | 
Impedance Test Report
| Sample NO. | Layer | Line Width(mil)±10% | Line Space (mil)±10% | Impedance Type | Required Value (ohm) | Tolerance | Actual Value | Result | |
| Single End | Differential | ||||||||
| 1 | L3 | 6.000 | 7.000 | V | 90.00 | ±10% | 93.59 | ACC | |
| L3 | 6.000 | 10.000 | V | 100.00 | ±10% | 102.33 | ACC | ||
| L4 | 7.000 | 7.000 | V | 90.00 | ±10% | 88.99 | ACC | ||
| L4 | 6.000 | 7.000 | V | 90.00 | ±10% | 90.76 | ACC | ||

|   | 
 High Tg Printed Circuit Board (PCB) Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold
                                                                                    
                        
                        
                        
                                                            High Tg Printed Circuit Board (PCB) Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold
                                                    
                        
                     High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB
                                                                                    
                        
                        
                        
                                                            High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB
                                                    
                        
                     High Tg Lead Free Multilayer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
                                                                                    
                        
                        
                        
                                                            High Tg Lead Free Multilayer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
                                                    
                        
                     Kappa 438 RF Printed Circuit Board Rogers 30mil 0.762mm DK 4.38 PCB with Immersion Gold for Small Cells
                                                                                    
                        
                        
                        
                                                            Kappa 438 RF Printed Circuit Board Rogers 30mil 0.762mm DK 4.38 PCB with Immersion Gold for Small Cells
                                                    
                        
                     Kappa 438 RF PCB Rogers 60mil 1.524mm DK 4.38 Printed Circuit Board with Immersion Gold for Wireless Meters
                                                                                    
                        
                        
                        
                                                            Kappa 438 RF PCB Rogers 60mil 1.524mm DK 4.38 Printed Circuit Board with Immersion Gold for Wireless Meters
                                                    
                        
                     High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers
                                                                                    
                        
                        
                        
                                                            High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers
                                                    
                        
                     High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance
                                                                                    
                        
                        
                        
                                                            High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance
                                                    
                        
                     Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg  Multi-layer TU-883 PCB
                                                                                    
                        
                        
                        
                                                            Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg  Multi-layer TU-883 PCB
                                                    
                        
                     High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB
                                                                                    
                        
                        
                        
                                                            High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB