wafer level chip scale package

Brand Name:Hiner-pack

Model Number:3 Inch Series

Place of Origin:Made In China

...Chip Scale Package Transporting IC Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale

Brand Name:TI

Model Number:TPS63036YFGR

Place of Origin:original

TPS63036YFGR Power Management ICs High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package 8-UFBGA Product Status Active Function Step-Up/Step-Down Output Configuration Positive Topology Buck-Boost Output Type ...

Brand Name:Sme Electromechanical PLC Drive Cleaning Machine Purification System 8200 Specifications Sufficient Supply Delivery

Model Number:SME-8200

Place of Origin:china

Product Description: The Semiconductor Cleaning Machine is an automatic cleaning device that is designed to effectively remove water-based flux and other types of contamination from various electronic components. Measuring 8250*1970*1770mm (L*W*H), this ...

Brand Name:Mingseal

Model Number:SS101

Place of Origin:China

... of Fan-Out 2.5D Chip on Wafer on Substrate (CoWoS) processes. Equipped with dedicated underfill valves, the SS101 precisely dispenses fine volumes for small bump and narrow ...

Brand Name:GST

Model Number:GST412W

Place of Origin:Wuhan, Hubei Province, China

... adopts the Wafer Level Packaging (WLP) technology that has low cost and high yield on the market. Thanks to the wafer level packaging, the GST412W thermal infrared detector could produce clear infrared thermal image up to 120,000 pixels without

Brand Name:ADI

Model Number:ADUC7023BCBZ62I-R7

Place of Origin:CN

... in Wafer-Level CSP FEATURES Analog I/O Multichannel, 12-bit, 1 MSPS ADC Up to 12 ADC channels Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 4 DAC outputs available On-chip voltage reference On-chip ...

Brand Name:BeyondView

Model Number:FW312

Place of Origin:Beijing

... microbolometer structure has optimal sensitivity to long wavelengths between 8 and 14µm. FW312 infrared detector uses wafer-level packaging technology to minimize size and weight while ensuring stability and reliability, achieving a more compact and

Brand Name:Original Factory

Model Number:QCS-2290-0-NSP752-MT-00-0

Place of Origin:CN

...Chip QCS-2290-0-NSP752-MT-00-0 Dual-Channel System On Chip QFN Package Product Description Of QCS-2290-0-NSP752-MT-00-0 QCS-2290-0-NSP752-MT-00-0 is robust entry-level offering, enabling reliable performance and power-conservation with upgraded features and memory support for low power consumption in its tier. Equipped with the Cortex A53 CPU architecture, the entry-level...

Place of Origin:Henan, China

Brand Name:HDF

...Level Henna Powder Packaging Machine Guangzhou Product Description Model HDF-B302C Bag width 25-145mm Bag length 30-180mm Filling range 40-220ml Packing speed 20-60 bags/min Power 220v/2.2kw Size 650*1050*1950mm Weight 280kg The salt packaging machine adopts the world's most advanced microcomputer chip...

Brand Name:Gracias

Model Number:YH-320/420/520/620KT

Place of Origin:China

...Scale Packaging Machine Applications: Applicable to the automatic packaging of granular, flake,blockand other products with a diameter of not more than 6cm in thechemical, food, health care and pharmaceutical industries,such as: washing powder, plastic granules, sugar, salt, spiceseasoning, soybean,corn kernel, peanut , melon seeds, broadbeans, nuts, potato chips...

Brand Name:SunChon

Model Number:SUN-420

Place of Origin:China(Mainland), Guangdong

... (potato chips) Https://www.youtube.com/watch?v=AqiAZramjX4 4 heads weigher powder packing machine Trade Assurance Supplier Multi-Function Small Scale Packaging Machine For Popcorn / Sugar / Crisps /Peanut Features 1.All the packing process can ...

Brand Name:ANALOG DEVICES

Model Number:ADA4841

Place of Origin:USA

ANALOG DEVICES ADA4841 IC integrated circuit mcu chip ADA4841 Electronic Components The ADA4841 offers a high performance at a very low cost 266 MHz/1596 MFLOPs -- within the third generation SHARC Processor family. This level of performance makes the ...

Brand Name:TEXAS INSTRUMENTS

Model Number:SN74AHC123AD

Place of Origin:original

SN74AHC123AD New And Original SOP16 Integrated Circuit ISO9001.pdf Product Technical Specifications EU RoHS Compliant ECCN (US) EAR99 Part Status Obsolete HTS 8542.39.00.01 SVHC Yes Automotive No PPAP No Logic Family AHC Logic Function Monostable ...

Brand Name:STARLAND

Model Number:XT-28

Place of Origin:Guangdong guangzhou

Large Scale Wafer Cone Making Machine with CE Features of Wafer Cone Making Machine Are you ready to take your wafer cone production to the next level? Look no further than our incredible Large Scale Wafer Cone Making Machine! With its high precision molds...

Brand Name:zmkj

Model Number:12inch 300mm single wafer container box

Place of Origin:CHINA

...Wafer Box Wafer Carrier Container Box Silicon Sapphire Box for 300mm semiconductor wafer shipping 2inch/3inch/4inch/6inch/8inch single wafer container box Waterproof 12 Inch Single Wafer Carrier Box Environmental Friendly Our company provides 1-inch, 2 inch, 2.5 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch single-chip silicon box, single-chip wafer box, single-chip silicon box, IC tray chip packaging...

Model Number:40PC150G2A

Place of Origin:USA

...crystal material. The design integrates temperature compensation, output zero and full-scale calibration, and amplification functions into a single silicon chip through a monolithic silicon wafer design. Pin Package: 6-pin DIP (Dual In-line Package). Three

Brand Name:FUNSONIC

Model Number:FS620

Place of Origin:CHINA

...Wafer Coating Description: Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer

Brand Name:BonTek

Model Number:Fused Silica, Fused Quartz

Place of Origin:China

...Wafer 4'' 6'' 8'' for MEMS Devices Glass wafers made of borosilicate glass are often used in Semiconductor and MEMS industry in a wide variety of applications. These wafers can be used for the encapsulation of MEMS devices for example for sensors using Wafer-Level-Packaging (WLP) technology or as blank glass substrates for semiconductor processing and optics. The borosilicate glass wafers...

Brand Name:iPAPA

Model Number:400

Place of Origin:CHINA

...wafers/Wafer rolls Description: Industrial 400mm belt width chocolate enrobing machine for wafers/Wafer rolls is best choice for the daily chocolate consumption on caoting within 400-600kg,they are mainly designed for these medium level production. The 400mm chocolate enrobing machine can attach with various length of cooling tunnel to meet the industrial scale...

Brand Name:N/A

Model Number:TW-MC-003

Place of Origin:China

...WAFER Package, IP65 level and shockproof, safe data protection. Slim size, huge data capacity inside. Easy way to assemble different shape or cover into a USB flash drive. What is important inside UDP? Memory Chip. We use Samsung, Toshiba, Micron, Hynix, Sandisk and Intel. All our chip...