package substrates

Brand Name:Horexs

Place of Origin:CHINA

...package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...

Categories:IC Substrate PCBs

Country/Region:china

Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, ...

Categories:IC Substrate PCBs

Country/Region:china

Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, ...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Place of Origin:China

Brand Name:Jiaqing Circuit

BT (Bismaleimide Triazine) resin substrates, originally developed by Mitsubishi Gas Chemical, represent the dominant substrate material for semiconductor IC packaging. Over 70% of organic IC package substrates use BT-based laminate systems. This high-...

Brand Name:wuxi special ceramic

Place of Origin:China

Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...

Brand Name:ZMSH

Place of Origin:China

Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...

Place of Origin:China

...ch makes it ideal for use in optics and other applications where transparency is important. The Sapphire Substrate comes in a package of 25/cassette, making it easy to handle and store. The substrate features a sapphire template layer and is oriented along

Brand Name:YH

Model Number:YH

Place of Origin:CHINA

High Density Superior Thermal Conductivity 96 99 9999 Alumina (Al2O3) Substrates for Semiconductor Packaging Alumina (Al₂O₃) ceramic plates: Alumina (Al₂O₃) ceramic plates are advanced engineering components manufactured from high-purity aluminum oxide. ...

Brand Name:Customized

Place of Origin:China

...substrate lamination WL-CT338.The ceramic substrate material is widely used in electronic packaging substrate for its advantages such as high strength, good insulation, good thermal conductivity and heat resistance, small thermal expansion coefficient and good chemical stability. Product type High Frequency PCB Materail Ceramic substrate...

Brand Name: Yuxing

Place of Origin:china

Product Description: The Ceramic Substrates are advanced materials designed specifically for high-performance applications such as Diesel Oxidation Catalysts. These substrates provide a reliable and efficient foundation for catalytic processes, ensuring ...

Model Number:G3010

Brand Name:POSEIDON

Place of Origin:Guangzhou, China

...Packaging Hot Melt Adhesive - For Food & Coated Substrates, White Granule Good Coated Surface Adhesion About Poseidon RO254 Hot Melt Adhesive Hot melt adhesive RO254 appears as white granules and features stable melting performance. It is designed for bonding food packaging and coated substrates...

Brand Name:ZMSH

Place of Origin:SHANGHAI,CHINA

...packaging and high-power electronic applications. Manufactured using proprietary MPCVD diamond growth technology, the film features a self-supporting structure with thicknesses ranging from 5 μm to 25 μm, eliminating the need for rigid carrier substrates...

Brand Name:Guofeng

Model Number:HPSYD

Place of Origin:HEFEI, CHINA

...Substrate for Labels & Packaging Product Attributes Attribute Value Product name High-Gloss BOPP Film 38μm - Premium Printing Substrate for Labels & Packaging Material BOPP Processing Type Extrusion Strech Type Bi-axially Oriented Thickness 38μm Width Customized Length Customized Package...

Brand Name:Xingqiang

Model Number:As Per Customer's Model

... substrates support critical signal routing, thermal dissipation, and mechanical stability for advanced semiconductor applications. Our team tailors layer structures, ...

Place of Origin:China

Model Number:3721

Brand Name:Super-curing

...Packaging Protective Adhesive is a UV-curable adhesive specially formulated for the protection of glass substrates in thinning-type packaging applications, such as TFT glass thinning encapsulation. Key Features Excellent acid & alkali chemical resistance Excellent adhesion to glass and metal substrates Superior damp-heat resistance and flexibility Multiple substrate...

Categories:PCB Depanelizer

Country/Region:china

... efficient cutting mode; the maximum processing workpiece size is 150* 150mm, suitable for small packaging substrate materials, soft materials cutting, manual loading and unloading, automatic transmission and positioning, automatic alignment cutting. 1.The