flip chip bonding ceramic substrate

Brand Name:ZMSH

Model Number:SiC Ceramic Vacuum Chuck

Place of Origin:CHINA

...​​Flip-Chip Bonding processes​​ in semiconductor manufacturing. Its core function is to ​​stably adsorb and secure wafers or dies​​ during bonding, ensuring ​​micrometer or even sub-micrometer-level alignment and interconnection​​

Place of Origin:CHINA

Brand Name:White Smart

... Dia 21mm Wet Inlay Size Dia 25mm Chip RFID Memory 144/504/888bytes Antenna Aluminium etching antenna Bonding Flip chip Unwinding chip side up Thickness 0.07mm Reading Distance 1.5~3cm (depends on reader applied) Operation Temp. -20°C~+65°C Storage Temp. -...

Place of Origin:Hunan, China

Brand Name:OEM

Model Number:Customized

Direct Bond Copper Alumina Metallized Ceramic DBC Substrate For Power Electronics Why choose us? 1. Support custom made metalized ceramic substrates, whatever, it's prototyping project, or cost down. 2. With over 15 years of OEM, ODM manufacturing ...

Brand Name:wuxi special ceramic

Place of Origin:Made in China

... heating tube, refractory material, and heating element. Zirconia ceramics have sensitive electrical performance parameters and are mainly used in oxygen sensors, solid oxide fuel cells (SOFC) and high temperature ...

Brand Name:Tyanshine

Model Number:TX-6066RGBW250FC120-NUVENG-01

Place of Origin:CN

... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower Forward Current result in Lower heat-emission to

Brand Name:LERANEW

Model Number:LN-AFS40PWW-PS120-29

Place of Origin:CHINA

Flip chip 120W high efficiency led cob chips white color BICOLOR-STARRY super aluminum substrate Product Specifications Models LN-AFS40PWW-PS120-29 Power 120W Color temperature WW: Warm white=2800-3200K NW: Neutral white=4000-4500K PW: Pure white=5000-6000K Luminous efficiency 110-130lm/w Working voltage 35-38V Circuit 12S20P*2 Size 40*40mm LES(Diameter) R29MM/R18MM View angle 120DEG CRI >80 SUBSTRATE...

Brand Name:Horexs

Place of Origin:china

...Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications (0.3mmt for 1-2-1) Applicable environmentally-friendly products (Halogen-free, Lead-free) ...

Brand Name:ASM

Model Number:NANO

Place of Origin:China

...Flip Chip Bonder Machine ASM NANO Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder Machine Infinite Automation is the best choice if you are looking for dependable Factory Automation Machines and Production Equipment. Among Our offered machines are original and pre-owned Die Bonding and Die Attach, Wire Bonding, Die Bonder and Flip Chip...

Brand Name:GKG

Model Number:GD602D

Place of Origin:China

... Features 1. Utilizes a sheet-to-sheet docking station with dual swing arms for 180° cross-bonding. 2. Compatible with a printer to enable a variety of in-line process solutions. 3. Fully integrated carrier from loading, printing, to die bonding and

Brand Name:Ruideer

Model Number:Customizable

Place of Origin:China

Vacuum brazing furnace for AMB bonding of ceramic substrates This equipment is used for AMB copper cladding process of Si3N4 and Aln substrates.It can also be applied to vacuum and high temperature degassing sintering of high density alloys, tungsten-...

Brand Name:ZG

Model Number:MS

Place of Origin:China

Aluminum Nitride Ceramic Substrate Characteristic: Strength Stable shape Anti-corrosion High insulation Strong bonding High thermal conductivity It has strong mechanical stress Excellenthermalcyclingperformance Quality Control:

Brand Name:Unicomp

Model Number:AX9100

Place of Origin:China

... Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution ...

Brand Name:YAGEO

Model Number:RC0603FR-0751KL

Place of Origin:China

Chip Resistors 0603 100KΩ For household appliances Features • Extremely thin and light • Highly reliable multilayer electrode construction • Compatible with all soldering process • Highly stable in auto-placement surface mounting applications • Barrier ...

Brand Name:Mingrui

Model Number:XF-121

Place of Origin:China

...black or customed Custom normally Surface smooth , glossy Machinable yes precision high Used ceramic substrates Alumina Ceramic Blocks consist of pure copper bonded to a ceramic substrate such as Al2O3 (Alumina), AlN (Aluminum Nitride), HPS (ZrO2 doped) or

Brand Name:Original brand

Model Number:MFC2817-R10FT1

Place of Origin:Original

...Chip Resistor Metal Foil Resistors General Purpose MFC2817-R10FT1 SMD 3W 0.1 ohm +/-1% Ceramic Resistor Feature > Small size down to 0603 > TCR down to ±30ppm/°C > Current sensing for power electronics > High power density > 2817 & 4320 AEC-Q200 Qualified Construction Metal foil resistor material is bonded onto a 96% alumina substrate...

Brand Name:TI

Model Number:SN74HC374N

Place of Origin:Original

... ►Package Options Include Plastic Shrink Small-Outline (DB), Small-Outline (DW), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J)

Brand Name:TI

Model Number:SN74HC374N

Place of Origin:Original

... ►Package Options Include Plastic Shrink Small-Outline (DB), Small-Outline (DW), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) DIPs description These

Brand Name:ZMKJ

Model Number:8inch sic wafers 4h-n

Place of Origin:CHINA

Custom Size Ceramic Substrate / Silicon Carbide Ceramic Excellent CorrosionSingle crystal single side polished silicon wafer sic wafer polishing wafer manufacturer Silicon Carbide SiC Wafer4H-N SIC ingots/High purity 4H-N 4inch 6inch dia 150mm silicon ...

Brand Name:FunMeet

Model Number:FMXC-ZG-002

Place of Origin:Zhengzhou, China

...Ceramic Sintering Gasket- long working life and reuse Electronic Component substrates Introduction Electronic substrates are base supports for production of electronic circuits used in applications such as computer chips, multi-chip modules, circuit boards and disk drives. Ceramic substrates...

Brand Name:United Chemi-Con

Model Number:KTJ251B335M76BFT00

... Multilayer Ceramic Capacitors (MLCCs) feature small size and large capacitance, high ripple current, X7R temperature characteristics, and excellent noise absorption. The NTJ series is suitable for reflow soldering and aluminum substrate. The MLCCs have a