ball grid array rework

Place of Origin:China

Precision BGA Assembly – Fine-Pitch & Ball Grid Array Overview Ball Grid Array (BGA) components are at the heart of modern high-density electronics—enabling complex functionality in compact form factors. However, BGA assembly ...

Brand Name:TELIT

Model Number:GL865-QUAD

Place of Origin:China

... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely ...

Brand Name:Bicheng

Model Number:BIC-462.V1.0

Place of Origin:CHINA

PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the ...

Brand Name:Dux PCB

Model Number:BGA Assembly

Place of Origin:China

BGA PCB Assembly Services Micro-BGA, PoP, and Fine-Pitch Assembly with Zero-Defect Assurance DuxPCB delivers high-end Ball Grid Array (BGA) assembly services, specializing in the most challenging footprint technologies. From standard FPGAs to complex Micro...

Brand Name:FASTPCBA

Model Number:Bga Pcb Assembly

Place of Origin:China

PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly Quick Turn prototype and mass production PCB FASTPCBA dedicated in manufacturing 1-48 layers quick turn prototype and mass production High precision PCBs with the principle of “the Best quality, the ...

Brand Name:Bicheng Technologies Limited

Model Number:BIC-462-V7.8

Place of Origin:China

PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the ...

Brand Name:HNL-PCBA

Model Number:Rapid PCBA

Place of Origin:CHINA

OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ...

Brand Name:Suntek

Model Number:FPA8569-NE4

Place of Origin:China

New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ...

Brand Name:HTF

Place of Origin:Guangdong, China

HTF provides OEM electronics manufacturing with nitrogen reflow soldering for BGA PCBA assembly of BMS battery management system and battery charging applications on FR4, FR1-4, PI polyimide, copper, and aluminum base materials with 0.5-6OZ copper ...

Brand Name:YDY

Model Number:E-002

Place of Origin:China

Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly​ Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our...

Brand Name:FASTPCB

Place of Origin:CHINA

Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ...

Brand Name:XILINX

Model Number:XC6SLX16-2FTG256C

Place of Origin:TW

XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ...

Categories:EMMC Memory Card

Country/Region:china

Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ...

Brand Name:Jrkconn

Model Number:PGA - 12 Series

Place of Origin:Guangdong, China

...devices with a high number of pins arranged in a grid pattern. These sockets allow for reliable electrical connections and easy insertion/removal of PGA-packaged chips. Common pitch sizes ...

Brand Name:INTEL

Model Number:WP81341M0820

Place of Origin:USA

... material Plastic Encapsulate the code BGA Encapsulation equivalent code BGA1357,37X37,40 Packaging shape :SQUARE Encapsulated :Grid Array The power of: 1.2

Model Number:HS-700

Place of Origin:China

Brand Name:HSTECH

...a high-performance, professional-grade repair solution designed specifically for advanced smartphone maintenance and PCB rework. Engineered to meet the rigorous demands of modern electronics repair, this station combines intelligent temperature control,

Brand Name:WDS

Place of Origin:CHINA

Model Number:WDS620

...Rework Station is a state-of-the-art solution designed for precision and efficiency in the repair and rework of Ball Grid Array (BGA) components. Engineered to meet the demands of modern electronic manufacturing and repair environments, this rework station combines advanced technology with user-friendly features to ensure optimal performance and reliability. One of the standout features of this rework

Brand Name:Intel

Model Number:EP4CE40F23C8N

EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone® IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Voltage - Supply 1.15V ~ 1.25V Mounting Type ...

Brand Name:Intel

Model Number:EP4CE40F23I7N

...Description: The Altera EP4CE40F23I7N is a Field Programmable Gate Array (FPGA) device from the Cyclone IV E family. It has a total of 328 I/O pins and is packaged in a 484-pin Fine-pitch Ball Grid Array (FBGA) package. Features: • High-performance, low-...

Brand Name:Original Factory

Model Number:XCVU7P-1FLVB2104I

Place of Origin:CN

...Array XCVU7P-1FLVB2104I Embedded FPGA Chips 2104FCBGA​ Product Description Of XCVU7P-1FLVB2104I XCVU7P-1FLVB2104I is Embedded FPGA Chips - Field Programmable Gate Array, package is 2104-BBGA, Surface Mount. Specification Of XCVU7P-1FLVB2104I Part Number: XCVU7P-1FLVB2104I Package: 2104-FCBGA Size: 47.5mm X 47.5mm Dry Rework...