ball grid array assembly bga

Brand Name:FASTPCBA

Model Number:FASTPCBA-004

Place of Origin:China

PCB Assembly SMT , BGA , DIP Double-Sided Pcb Assembly Factory Product description: Specializing in the production of high-precision and high- difficulty double-sided multilayer PCB circuit boards, double-sided multilayer PCB circuit board proofing batch ...

Place of Origin:China

...BGA Assembly – Fine-Pitch & Ball Grid Array Overview Ball Grid Array (BGA) components are at the heart of modern high-density electronics—enabling complex functionality in compact form factors. However, BGA assembly demands exceptional precision: solder joints are hidden beneath the component body, making visual inspection impossible and quality verification reliant on advanced X-Ray systems. Studio Electronics delivers Precision BGA

Brand Name:Dux PCB

Model Number:BGA Assembly

Place of Origin:China

... footprint technologies. From standard FPGAs to complex Micro-BGAs (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment and process maturity to ensure reliable interconnections. The challenge with BGA technology is visibility.

Brand Name:HNL-PCBA

Model Number:Rapid PCBA

Place of Origin:CHINA

OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ...

Brand Name:YDY

Model Number:E-002

Place of Origin:China

Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly​ Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our...

Brand Name:TELIT

Model Number:GL865-QUAD

Place of Origin:China

... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely compact applications. Since

Brand Name:Bicheng

Model Number:BIC-462.V1.0

Place of Origin:CHINA

...Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference) 1.1 General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA...

Brand Name:Bicheng Technologies Limited

Model Number:BIC-462-V7.8

Place of Origin:China

...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on

Brand Name:Suntek

Model Number:FPA8569-NE4

Place of Origin:China

New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ...

Brand Name:HTF

Place of Origin:Guangdong, China

HTF provides OEM electronics manufacturing with nitrogen reflow soldering for BGA PCBA assembly of BMS battery management system and battery charging applications on FR4, FR1-4, PI polyimide, copper, and aluminum base materials with 0.5-6OZ copper ...

Brand Name:FASTPCB

Place of Origin:CHINA

Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ...

Brand Name:XILINX

Model Number:XC6SLX16-2FTG256C

Place of Origin:TW

XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ...

Categories:EMMC Memory Card

Country/Region:china

Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ...

Brand Name:INTEL

Model Number:WP81341M0820

Place of Origin:USA

...: unknown JESD - 30 : S - PBGA - B1357 code The number of terminals :1357 Packaging body material Plastic Encapsulate the code BGA Encapsulation equivalent code BGA1357,37X37,40 Packaging shape :SQUARE Encapsulated :Grid Array The power of: 1.2

Brand Name:Shinelink

Model Number:SL0925S01

Place of Origin:China

...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the

Brand Name:HSTECH

Model Number:HS-800

Place of Origin:China

...BGA Rework Station for Electronic Assembly​ Introduction: A BGA Rework Station is specialized equipment used for the repair and rework of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential in electronics manufacturing and repair, allowing technicians to replace or repair BGAs...

Brand Name:Intel

Model Number:EP4CE40F23C8N

EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone® IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Voltage - Supply 1.15V ~ 1.25V Mounting Type ...

Model Number:WDS-620

Brand Name:Wisdomshow

...BGA Rework Station is a highly advanced and versatile tool designed for precise and efficient rework of Ball Grid Array (BGA) components. Tailored for both professional technicians and electronics enthusiasts, this BGA rework station combines cutting-edge technology with user-friendly features to deliver exceptional performance in PCB repair and assembly tasks. One of the standout features of this BGA

Brand Name:Yizhuo

Model Number:Aluminum Pcb Board 01

Place of Origin:China

..., sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name:

Brand Name:ABIS

Model Number:H-PCB2

Place of Origin:China

...Assembly ISO14001 PCBA Electronic Pcb Assembly Technical capabilities: -PCBA Capacity Single and double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.008 in. (0.2 mm) Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in. Assembly...