4layer csp semiconductor substrate

Brand Name:UNICOMP

Model Number:AX9100MAX

Place of Origin:China

... for IC curvature measurement and various electronic components with micro-focus 2D/2.5D imaging technology. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules,

Brand Name:Horexs

Place of Origin:CHINA

... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach Chip to the laminated substrate with wire-bonding and encapsulate it by using plastic-type molding compound ,

Brand Name:zmkj

Model Number:Indium arsenide (InAs)

Place of Origin:CHINA

... Substrate Indium Arsenide InAs wafer Application Indium Arsenide (InAs) single crystal semiconductor substrates are materials with unique properties, widely used in the electronics and optoelectronics fields. Here are some possible applications: 1.

Brand Name:TANKBLUE

Model Number:4h-n

Place of Origin:CHINA

...Semiconductor High Crystal Quality For Demanding Power Electronics, 4H-N 8inch TANKBLUE Brand Semiconductor Substrate SIC Silicon Carbide Wafer For Solar Photovoltaic Advantages of Silicon Carbide Hardness There are numerous advantages to using silicon carbide over more traditional silicon substrates. One of the ...

Brand Name:Jiaqing Circuit

Place of Origin:China

...substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate...

Brand Name:Wisdomshow

Model Number:S7000

Place of Origin:China

CSP LED X Ray Machine Closed Tube Flip Chip S7000 For 100KV Semiconductor Application: Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace ...

Brand Name:TYANSHINE

Model Number:TX-5260WS200D180-001

Place of Origin:CN

... Variety of power selections for different applications COB Package LED Arrays, high performance Heat emitting Al. PCB substrate Product Specifications:

Brand Name:YH

Model Number:YH

Place of Origin:China

... ceramic solution for the semiconductor industry, our Aluminum Nitride (AlN) Ceramic Substrate is engineered for high-power semiconductor modules. With semiconductor devices trending toward high integration and power density, thermal management has become

Brand Name:wuxi special ceramic

Place of Origin:China

... thermal conductivity Aluminum Nitride (AIN) ceramic, this substrate offers exceptional thermal management and electrical insulation properties, making it an ideal choice for a wide range of industrial applications. Surface Finish: ...

Brand Name:SHENHUA

Model Number:SC810

Place of Origin:Guangdong, China

Product Description SC810 is a compact in line spray cleaning machine for leadframe, IGBT, IPM,BGA, CSP package flux clean by using liquid wash and DI water rinse and hot air dry. For all kinds of flux and leadframe, IGBT, IPM,BGA, CSP package. SC810 ...

Brand Name:TOPCBS

Model Number:0.45mm 4Layer flex main board with connectors WP27D-P050VA1 apply for VR helmet

Place of Origin:Suzhou China

0.45mm 4Layer flex main board with connectors WP27D-P050VA1 apply for VR helmet The combination of these two circuits makes it an extremely beneficial product for both applications as well as customers. Dynamism: Flexible circuits give you unlimited ...

Place of Origin:China

Brand Name:TOP SENSOR

Semiconductor Strain Gauge Transducer SPD High Speed Bending Plate Scales Semiconductor Strain Gauges SPD Semiconductor strain gauge (in the substrate) Send Inquiry SPECIFICATION Related Products Semiconductor strain gauge (in the substrate) F1 F2 F3 F4 F5 substrate: 8×4 silicon: D leg: 30 substrate: 7×4 silicon: B,C leg: 20~25 substrate: 8×3.5 silicon: B,C,D leg: 22 substrate: 8×2.5 silicon: B,C leg: 7.5~7.8 substrate...

Brand Name: Yuxing

Place of Origin:china

Product Description: Our Ceramic Substrates are engineered to meet the demanding requirements of modern industrial applications, offering exceptional performance and reliability. These Industrial Ceramic Substrates are designed with a focus on durability, ...

Model Number:PW-12

Place of Origin:CHINA

Brand Name:WINNER

...CSP IC Packaging Wire Ultra-fine 0.015mm Pd coated copper wire with compact palladium layer, stops copper oxidation, perfect for miniaturized CSP advanced chip packaging. Superior cost-effectiveness compared to gold bonding wire Excellent performance in semiconductor...

Brand Name:Hiner-pack

Model Number:HN2079

Place of Origin:Made In China

Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP). An anti-static tray is an ideal ...

Brand Name:Xingqiang

Model Number:As Per Customer's Model

... substrates support critical signal routing, thermal dissipation, and mechanical stability for advanced semiconductor applications. Our team tailors layer structures, line widths, pad layouts, and array formats to match your specific chip requirements,

Model Number:SGGG

Place of Origin:China

Brand Name:Crystro

... applications, offering exceptional quality and performance. Designed specifically for use in cutting-edge technologies, these substrates serve as a fundamental platform for semiconductor, electronic, and optical devices. With a dielectric constant of

Brand Name:Jinghui Ceramics

Model Number:Customized

Place of Origin:China

... ceramic substrate; 2. The thermal expansion coefficient (3.1×10-6/℃) matches the semiconductor silicon material (3.5-4.0×10-6/℃); 3. The bending strength is higher than that of the alumina substrate, which is twice that of the alumina substrate; 4.

Brand Name:JINXING

Model Number:Molybdenum Wafer

Place of Origin:China

... lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life. ​ Description Wafer substrate made of molybdenum, molybdenum copper and