CPU Thermal Pad Silicone Thermal Interface Material 5.0W/mK RoHS Compliant For Cooling Of Portable Electronics
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...Thermal Pad Silicone Thermal Interface Material 5.0W/mK RoHS Compliant For Cooling Of Portable Electronics Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF100-50-11S CPU Thermal Pad Silicone Thermal Interface Material 5.0W RoHS Compliant For Cooling Of Automotive Electronics
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...the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Their flexibility and...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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TIM Thermal Interface Materials Electronics Thermal Phase Change Material ROHS
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.... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm...
ZSUN CHIPS CO., LTD
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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Soft Thermal Conductive Insulating Gasket For Heat Transfer With Soft Compressible Tear-resistant Silicone Thermal Interface Materials
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... insulating product. lt incorporates insulating silicone substrates into thermally conductive materials to achieve both insulation and heat conduction. At the same time, the glass fibers provide excellent tear and puncture resistance. The product is...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
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...Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and bonding materials configured in a certain ratio, and processed through a special process to become a paste gap filling material......
Trumony Aluminum Limited
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5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
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5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
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ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease
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... with a pre-flash viscosity of 80 Pa·s, post-flash viscosity of 700 Pa·s, thermal conductivity of 6.2 W/m·K, thermal resistance of 6.1 mm²·K/W, and bond line thickness of 26 μm. Product Overview Optimized for screen printing, stencil printing,...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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High-Purity White D50 Spherical Alumina Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials
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... thermal conductivity, manufactured through advanced high-temperature melting technology. With its unique spherical morphology and high α-Al₂O₃ content, it delivers superior performance as a functional filler in thermal interface materials, ceramic......
Shaanxi KeGu New Material Technology Co., Ltd
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Silicone Practical Heatsink Cooling Pad , Reach Thermal Interface Material Pad
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0.5mm Ultra Soft High Breakdown Voltage 1.0W/m.K Thermal Silicone Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red Visual Thickness(mm) 0.5~12.0 ASTM D374 Density(g/cc) 2.5 ASTM ......
Shenzhen Aochuan Technology Co., Ltd
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