CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
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mobile phone COF driver Panasonic material PIGL042504-250MH, CU9/1um, Baoli oil + PI reinforcement Product Description Number of floors: 1 floor Plate thickness: 0.15mm, Panasonic material PIGL042504-250MH, CU9/1um, Baoli oil + PI reinforcement, minimum ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2
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...interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving high-density interconnections between chips, as well as between chips and substrates. While TSV (Through Silicon Via) technology is used for interposers in silicon-based substrates......
SHANGHAI FAMOUS TRADE CO.,LTD
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Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
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... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant electrical characteristics by short interconnection paths.SiP is a substrate that enables to combine 2 or...
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Dual-Station R&D Coater for Multi-Substrate Testing | Flexible Platform for Molded Pulp & Beyond
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Dual-Station R&D Coater for Multi-Substrate Testing | Flexible Platform for Molded Pulp & Beyond 1. Composition of Production Line A highly flexible platform featuring: two independently operable spin stations on a linear slide, a library of ......
Dongguan Osmanuv Machinery Equipment Co., Ltd
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Zirconia ZrO2 Ceramics Substrate Sheets Plates
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... close to that of steel. Mainly: Y-TZP grinding ball, dispersion and grinding media, nozzle, ball valve ball seat, zirconia mold, micro fan shaft, fiber pin, fiber sleeve, wire drawing die and...
Wuxi Special Ceramic Electrical Co.,Ltd
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100mm/S Speed Semiconductor Molding Machine Chip Molding Equipment Energy Saving
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...Molding Equipment Features: ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● Applicable leadframe/substrate......
Guangdong Taijin Semiconductor Technology Co., Ltd
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Overmolding Injection Molding Mold Accurate Plastic Injection Mold Tooling Customizable
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...substrate with a layer of soft plastic or rubber, giving the finished product both mechanical strength and a comfortable feel. It is widely used in the manufacture of high-end plastic products. Process Flow Mold design and overmolding structure determination Mold flow analysis to predict flow and adhesion CNC and EDM precision machining Mold......
MID Mould Industrial Ltd.
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718H S136 P20 P20H Plastic Injection Moulds With 2K Bezel substrate
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...-made plastic injection molding service molded plastic parts Mold Material S136/2344/718/738/NAK80/P20, etc. Plastic Material ABS, PP, PC, PVC, POM, TPU, PC, PEEK,HDPE,NYLON, PA6+30%GF, PA66, Silicone, Rubber, etc. Mold Base LKM,...
Shenzhen Benky Industrial Co., Ltd.
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Aluminum Electroforming Mold Precision Core Pins ±0.005mm Accuracy
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...Molds for Aluminum | ±0.005mm High Precision Engineered for versatility and precision, our electroforming molds excel in aluminum part production while supporting diverse materials—delivering ±0.005mm accuracy to meet the strict demands of high-precision manufacturing. Whether you’re producing aluminum components or working with other substrates, these molds......
Dongguan Heya Precision Mold Co., Ltd
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Dark Gray Zirconia Ceramic Substrate: High-Precision, High-Temperature Resistant Rectangular Insulation Substrate
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...Substrate: High-Precision, High-Temperature Resistant Rectangular Insulation Substrate Product Introduction This product is a dark gray rectangular substrate made from high-purity zirconia ceramic, featuring a mirror-smooth surface achieved through precision polishing and an integrally molded......
Dayoo Advanced Ceramic Co.,Ltd
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