BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface
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BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing Tray Antistatic trays are among those things that should top your must-have list......
Shenzhen Hiner Technology Co., Ltd.
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BGA IC Package Substrate With Cap Plated MGC BT material
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Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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H9HCNNN8KUML-HRNME Low Power 8Gb LPDDR4 Synchronous DRAM Memory IC Chip in BGA-200 Package
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...BGA-200 package. Specifications Of H9HCNNN8KUML-HRNME Memory Size:8Gb Memory Organization:256M x 32 Package:BGA-200 Voltage - Supply:1.1V(VDD2,VDDCA,VDDQ) Control signal supply voltage: 1.8V (VDD1) Clock frequency:2.......
ShenZhen Mingjiada Electronics Co.,Ltd.
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88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 MARVELL LQFP80 BGA IC Integrated Circuits Components
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...ICs) 88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 MARVELL LQFP80 BGA IC Integrated Circuits Components Specification :88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 Category Integrated Circuits (ICs) Product Name Electronic components Model number 88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package......
Angel Technology Electronics Co
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88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 MARVELL LQFP80 BGA IC Integrated Circuits Components
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...ICs) 88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 MARVELL LQFP80 BGA IC Integrated Circuits Components Specification :88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 Category Integrated Circuits (ICs) Product Name Electronic components Model number 88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package......
HK NeoChip Technology Limited
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IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning
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IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning The Unicomp AX8300 is a professional, purpose-built X-ray ......
Unicomp Technology
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XC6SLX9 Programmable Logic ICS Bga Ic Chips SMT SMD FBGA
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...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package......
ChongMing Group (HK) Int'l Co., Ltd
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XC6SLX9 Programmable Logic ICS Bga Ic Chips SMT SMD FBGA
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...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package......
LU'S TECHNOLOGY CO., Ltd.
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GM8312SF-BA Integrated Circuit BGA IC Chip
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GM8312SF-BA Integrated Circuit BGA IC Chip List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND SW-438TR-3000 M/ACOM ......
Shenzhen Koben Electronics Co., Ltd.
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Customized Image Sensor Packaging Services For PLCC BGA Ceramic Packages
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...adaptability, and compatibility with end devices. For image sensors of various sizes provided by customers across different industries, we offer customized packaging services for PLCC, BGA, and ceramic housings. Using sensor size parameters as the core, we...
Chongqing Zhongshun Microelectronics Co., Ltd
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