FeNiCo Shell Robust 8pin To Transistor Packages Header
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...plated Ni:2~11.43um and Au≥1.3um;Cap is plated Ni:2~11.43um Product Formation Material Quantity 1. Base 4J29 1 2. Glass insulator BH-A/K 8 3. Pin 4J29 8 4 .Cap 4J42 1 Insulation Resistance 500V DC resistance between all the pins linked and base is ≥1...
JOPTEC LASER CO., LTD
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TO63-03A Hermetic Sealing Package for Power Devices
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Product Overview Product Name: TO63-03A Hermetic Sealing Package Model Number: TO63-03A Package Type: TO-style metal can (Transistor Outline) Sealing Technology: Glass-to-Metal Sealing (GTMS) Materials: Housing: Kovar alloy (Fe-Ni-Co) or stainless steel ......
Huona (Shanghai) New Material Co., Ltd.
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