4L build up types 0.8mm Gold Surface IC Package Substrate
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.../Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand:SHENGYI,......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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DFN2114 Carrier Tape For Compact IC Packaging With Black Anti Static PC+PS Material And 8mm x 1500m Reel
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Product Description This DFN2114 Carrier Tape is designed for compact DFN IC component packaging, reel storage, long distance transportation protection, SMT automatic feeding, and component sorting. It is made from PC+PS material and belongs to the black ......
GuangDong Zhongzai Electronic Technology Co., Ltd.
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High-Speed eMMC Memory Card with 330MB/s Read and 240MB/s Write Speeds in Compact 11.5x13x0.8mm BGA153 Package
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eMMC IC FLASH 64GBIT EMMC 153FBGA FLASH NAND Memory IC 128GB 64Gb 32GB 16GB 8G X 8 eMMC5.1 153 WFBGA 11.5x13x0.8 WHY CHOOSE US? 1.Strong research and development strength 2. Our factory has advanced packaging and testing technology 3. Complete storage ......
China Chips Star Semiconductor Co., Ltd.
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BT PCB Board Fabrication 0.2mm-8mm PCB Prototype Fabrication Service
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BT PCB | High-Tg Low-Loss IC Substrate | Memory & RF Chip Packaging | DuxPCB Overview of BT PCB BT PCB (Bismaleimide-Triazine) represents the pinnacle of substrate technology for IC packaging and high-frequency applications. Formulated from a unique blend......
DuxPCB Technologies Co., Ltd.
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Tailored IC Substrate Panel Micron-Level Circuit PCB for Semiconductor Chip Packaging
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... substrates support critical signal routing, thermal dissipation, and mechanical stability for advanced semiconductor applications. Our team tailors layer structures, ......
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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Tinplate Substrate Iron Metal Can Lids For 10L Round Industrial Chemical Paint Pail
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...Substrate Iron Metal Packaging Can Component 10L Round Industrial Chemical Paint Pail End Top Lid Pail Lid Material:Tinplate Usage: For metal can packaging Product Specification Parameter Value Cover Inner Diameter 233mm Depth 8mm Commond Material Tinplate/Substrate Iron Commond Thickness 0.28mm/0.32mm Commond Printing Process Single White Commond Peritoneal Process White Gold Film Packaging......
Delicacy packaging machinery co., ltd.
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8mmx36m PET Esd Packaging Tape Silver Gray Translucent
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... PET Tape Material: PET Size: 8mm*36m or Customized Sizes Color: Silver Gray Translucent Thickness: 0.14-0.15mm Adhesive: Single Sided Feature: ANTISTATIC Industrial use: Electronic,ESD shielding packaging raw material,IC PCB board,Factory Printing: No...
Suzhou Quanjuda Purification Technology Co., LTD
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TPS55340PWPR Power Management IC 3-V To 5.5-V Input Voltage Range
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... of ±3% - Up to 95% Efficiency - Operating Temperature Range of -40°C to 125°C - Small Footprint with 2.9mm x 3.8mm QFN Package - Low Operating Current of 1.3μA - Output Voltage Soft Start - Over-Temperature and Over-Current Protection Why buy from...
Shenzhen Sai Collie Technology Co., Ltd.
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