1.6mm Thick Double-sided Black Oil OSP PCB Rigid Board for Electronic Assembly

Application Adaptability​

1.welding reliability (such as automated SMT patch)

2.appearance consistency (such as black whole machine design)

3.insulation protection (such as double-sided dense circuits)

smartphone motherboards,

automotive central control modules,

small industrial sensors, etc.

Appearance Characteristics​

1.Double-sided black solder mask layer:

The surface presents a uniform matte or bright black color, with a unified visual effect and high recognition, suitable for equipment requiring high appearance texture (such as high-end electronic instruments, smart home products).​

Strong circuit concealment: The black solder mask ink can effectively cover the underlying circuit layout, with a certain degree of peep resistance, and at the same time reduce the interference of light reflection on the internal optical components of the equipment (such as camera modules, circuit boards around sensors).​

2.Performance Characteristics​

Excellent solderability: The OSP protective layer adheres to the copper surface through chemical adsorption, which can isolate the contact between air and copper, prevent copper foil oxidation, and ensure good welding activity after long-term storage, especially suitable for lead-free welding processes.​

Reliable insulation and protection: The black oil solder mask layer has a uniform thickness (usually 20-50μm) and high insulation resistance, which can effectively isolate adjacent circuits and prevent short circuits; at the same time, it has a certain degree of temperature resistance (usually can withstand short-term high temperatures of 130-180℃), moisture resistance and chemical corrosion resistance, protecting the circuit from environmental damage.​​

3.Process and Cost Characteristics​

Strong process compatibility: The OSP process is a lead-free and heavy metal-free environmental protection treatment method, in line with RoHS and other environmental protection standards; the black oil solder mask layer has good bonding with the OSP layer, and will not affect product stability due to process conflicts.​

Controllable cost: Compared with surface treatments such as gold plating and immersion gold, the OSP process has lower cost, and the black oil solder mask ink is a conventional material. The overall production process is simple, suitable for mass production, and can balance performance and cost.​

Limitations: The OSP layer has weak wear resistance and should avoid frequent friction; long-term exposure to high temperature and high humidity environments may affect the protection effect, so it is more suitable for indoor applications or applications with sealed enclosures.