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| Categories | High Frequency PCB |
|---|---|
| Brand Name: | xingqiang |
| Model Number: | Varies by goods condition |
| Certification: | ROHS, CE |
| Place of Origin: | China |
| MOQ: | Sample,1 pc(5 square meters) |
| Price: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
| Delivery Time: | 15-16 work days |
| Mask: | yellow+green |
| Finished Copper: | 35um/1oz |
| Pcb Thickness: | 1.6mm or Customized |
| Raw Material: | FR4 |
| Legend: | White |
| Silkscreen Colour: | White/based on your request |
| Quality: | 100% E-Test |
| Conductor Space: | 3 Mil |
| Pcb Surface Finishing: | HASL |
| Testing Method: | Flying Probe |
| Quotation requirements: | Gerber Files,BOM |
| Company Info. |
| Dongguan Xingqiang Circuit Board Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
High-frequency PCB
Our High-Frequency Printed Circuit Board (PCB) is precision-manufactured for demanding applications in RF, microwave, 5G communication, radar systems, satellite technology, and high-speed digital circuits. Designed to minimize signal loss, maintain impedance integrity, and ensure stable performance at GHz-level frequencies, this PCB is ideal for engineers and manufacturers in advanced electronic fields.Whether you're developing 5G base stations, automotive radar, or high-speed data transmission modules, our high-frequency PCB delivers exceptional dielectric performance, low insertion loss, and consistent signal integrity.
Brief Description of HDI PCB Advantages
1.High Wiring Density: Achieved through the use of Microvias (tiny, laser-drilled holes)
and finer lines/spaces. This allows for significantly more
circuitry in a smaller area, maximizing space utilization.
2. Superior Electrical Performance: The shorter trace lengths and optimized stack-up inherent in HDI
designs lead to better signal integrity, reduced signal latency,
and improved impedance control, which is crucial for high-speed
digital circuits.
3. Miniaturization and Weight Reduction: By increasing integration, HDI boards enable the design of
smaller, lighter, and thinner final products, making them ideal for
smartphones, wearables, and other portable devices.
4. Support for Advanced Packaging: They can accommodate components with very fine pitch, such as BGAs
(Ball Grid Arrays) and CSPs (Chip-Scale Packages), often using
Via-in-Pad technology for better component mounting reliability.
Ordering InformationPlease send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)
We’ll reply within 4 hours with a free quote, DFM report, and material recommendation.
Manufacturing process:
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