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FR4 Material Black Oil Drone Circuit Board PCB With ENIG Surface Treatment

Categories UAV PCB
Brand Name: UAV PCB
Place Of Origin: China
MOQ: Sample,1 pc(5 square meters)
Payment Terms: T/T,Western Union
Supply Ability: 10000㎡
Delivery Time: 15-20 Working Day
Model Number: Varies by goods condition
Certification: ROHS,CE
Price: NA
Place of Origin: China.
Min. Hole Size: 0.1mm
Min. Solder Mask Bridge: 0.08mm
Material: FR-4
Copper Thickness: 0.5-5.0oz
Silkscreen Color: White, Black, Yellow
Solder Mask Color: Green, Red, Blue, Black, White
Surface Finish: HASL, ENIG, OSP
Min. Line Width/Spacing: 3mil
Max. Panel Size: 528mm x 600mm
Layer Count: 2-30 layers
Board Thickness: 0.2-5.0mm
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FR4 Material Black Oil Drone Circuit Board PCB With ENIG Surface Treatment

Black oil Drone Circuit Board


Drone circuit boards are circuit substrates installed in electronic components such as flight control systems, image transmission systems, electronic speed controllers, power distribution modules (PDB), GPS modules, sensors, communication modules, and cameras. They are responsible for functions such as signal processing, power conversion, and communication control.


Structural and Material Characteristics:

  • Thickness: Common thickness is 0.8mm ~ 1.6mm.
  • Copper thickness: 1oz ~ 3oz, and thickened copper layers are often used in parts such as electronic speed controllers and power distribution.
  • Surface treatment: ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), HASL (Hot Air Solder Leveling), etc.
  • Materials: FR-4 is commonly used, and some high-end applications adopt polyimide (PI) or ceramic substrates to improve shock resistance and high-frequency characteristics.

Features:

  • The board is required to be thin and light, and the components are arranged compactly to reduce the total weight of the drone.
  • Adapt to the vibration environment during high-speed rotation and flight and outdoor temperature changes.
  • Multi-functional modules are integrated into one main board (such as the integration of flight control and PDB), reducing volume and weight.
  • Measures such as ground layer separation, filter wiring, and signal impedance control are adopted to reduce electromagnetic interference.

Special Processes:

  • HDI (High-Density Interconnect) board technology
  • Rigid-flex board (used in foldable arm drones)
  • High-frequency and high-speed materials (used for high-frequency signal transmission such as 5.8GHz image transmission and radar waves)


ItemConsumer DroneIndustrial DroneMilitary/Special Drone
Board materialOrdinary FR-4High TG FR-4 / PIPTFE / Ceramic substrate / Rogers
Number of layers4~8 layers6~12 layers8~20 layers + HDI + blind and buried vias
Copper thickness1~2oz2~3oz≥4oz (high-power modules)
Surface treatmentOSP/Deposit of goldImmersion Gold/Hot Air Solder Leveling/Anti-sulfurization ProcessImmersion Gold/Immersion Silver/Three-proof Coating
Anti-interference abilityMediumHighExtremely high (EMI/EMC reinforced design)
Applicable temperature range0~70℃-20~85℃-40~125℃ or higher
Communication functionsBluetooth/WiFi/Image transmission, etc.4G/5G/Data transmission/RTK GPSEncrypted communication/Radar/Electronic countermeasure links


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