Full Automatic 400x400mm Inline SMT Glue Dispensing Machine

An Inline SMT (Surface Mount Technology) Glue Dispensing Machine is an automated system commonly used in electronics manufacturing for dispensing adhesive (typically epoxy) precisely onto PCBs (Printed Circuit Boards) before component placement. This process ensures components are securely held in place during reflow soldering, especially on wave solder lines or when dealing with large or heavy components.

Thermal conductive adhesive, SMT bottom filling, component packaging, solder paste, red glue, black glue, semiconductor packaging, crystal cell fixation, etc

• PC control, Windows operating system, fault sound and light alarm, and menu display CCD visual positioning system.
• Adopting servo motor and screw drive.
• Can be equipped with: jet valve or other valves.
• Automatic constant temperature system of the valve body ensures consistent fluidity.
• Optional laser height detection system, which can automatically calibrate the Z-axis height after workpiece deformation.
• Optional workpiece heating system to enhance the fluidity of the coating during bottom filling.
• Optional precision weighing system, intelligent control and detection of dispensing amount, ensuring consistency of dispensing.

• Consumer Electronics – Smartphones, tablets, wearables.
• Automotive Electronics – ECUs, sensors, infotainment systems.
• Medical Devices – Compact and critical electronics.
• Aerospace & Defense – High-reliability electronics.
• Industrial Control Systems – PLCs, HMIs, and automation controls.

TYPICAL FLUID APPLICATION FOR SMARTPHONES