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| Categories | Electronic Components & Engineering Solutions |
|---|---|
| Model Number: | DAQ-PCBA-01 |
| Engineering Services: | Schematic design, PCB layout, DFM/DFA review |
| Cost Optimization: | BOM re-pinning and design cost-out |
| Place of Origin: | Guangdong, China |
| Firmware Development: | Sampling, filtering, calibration, Modbus/BLE/LoRa, OTA |
| Customization: | Tailored analog front-end and sampling firmware co-development |
| Service Scope: | Turnkey Sensor Interface and Data Acquisition PCBA ODM |
| Supply Ability: | 50000 Pieces per Month |
| Box-Build: | Enclosure integration into finished product |
| Board Layers: | 1-16 layers, FR4 |
| Delivery Time: | 5-7 working days for prototypes, 15-30 days for mass production |
| Testing: | ICT, FCT, precision calibration, temperature-cycle, AOI |
| Min Order: | 1 piece prototype |
| Prototype and Mass Production: | NPI samples to volume ramp |
| Signal Chain: | Low-noise instrumentation amp, high-resolution ADC |
| Brand Name: | OEM/ODM |
| Sourcing: | Full BOM component sourcing and alternate cross-reference |
| Certification: | ISO 9001:2015, IPC-A-610, RoHS, CE, FCC |
| Payment Terms: | T/T,L/C,PayPal |
| Packaging Details: | Anti-static ESD bag, foam-lined export carton with desiccant; assembled units secured in custom tray |
| Assembly Types: | SMT and DIP (through-hole) |
| Company Info. |
| Shenzhen Rocfly Blue Electronic Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Precision sensor front-end and data-acquisition boards engineered around your instrument, meter or monitoring device, with turnkey ODM development that speeds up your launch and lowers your total cost. We design, build and optimize — from schematic to a boxed, ready-to-ship product.
| Schematic Design | Sensor front-end capture, instrumentation amplifier, ADC and signal-chain selection matched to your accuracy needs. |
| PCB Layout | Low-noise, low-drift analog layout with grounding, guarding and isolation planned for clean measurement. |
| Component Sourcing | BOM scrubbing, authorized-channel sourcing and precision-IC availability planning. |
| DFM / DFA Review | Manufacturability and assembly feedback before tooling to prevent costly re-spins. |
| SMT and DIP Assembly | High-speed SMT plus through-hole DIP, wave/selective soldering and AOI inspection. |
| Firmware Development | Sampling, filtering, calibration and protocol stacks (Modbus, BLE, LoRa) plus OTA firmware. |
| Functional Testing | ICT, FCT and precision calibration fixtures with temperature-cycled verification and test-jig programming. |
| Box-Build Assembly | Enclosure integration, harness and connector mating, sealing and finished-goods packing. |
| Prototype and Mass Production | Rapid NPI samples, pilot build and scalable volume ramp on a single process. |
Our engineers custom-develop the sensor interface and its firmware for your measurement task, so the signal chain meets your resolution, speed and accuracy targets.
We do more than populate boards — we lower your total cost and shorten your time to market.
| BOM cost optimization | Cross-reference the BOM to equivalent parts that cut unit cost without losing accuracy or stability. |
| Design cost-out | Simplify layer count, consolidate passives and remove redundant parts early in the design. |
| Consolidated sourcing | One supplier, one BOM, fewer purchase orders and less overhead. |
| Faster NPI | Rapid prototyping and DFM feedback compress the design-build-test loop. |
| Supply chain resilience | Qualified second sources reduce stock-out and price-spike risk. |
A bare PCBA is only a component. This service carries the board all the way into a finished measurement product that ships ready to sell.
Send us your spec, schematic or 3D model
We will return a DFM summary, a BOM cost-reduction proposal and a prototype-to-production plan.
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