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| Categories | Memory Connectors |
|---|---|
| Stock: | 100000 |
| Model Number: | TFW13-S1F1-2000-A |
| Description: | Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS |
| Card Detection: | Yes |
| Height Above Board: | 2mm |
| Card Type: | MicroSD Card (TF Card) |
| Supplementary Features: | With Locating Pins |
| Brand Name: | TFW13-S1F1-2000-A |
| MOQ: | 1000 |
| Delivery Time: | 3-5工作日 |
| Card Connection Mode: | Push-Push |
| Connector Type: | Connector and Ejector |
| Packaging Details: | SMD |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Function: This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH., which is designed and manufactured by Company. ( T-FLASH .)
Usage/Application: T-Flash (TF) card connector for external soldering.
Advantages: Complies with RoHS directive. Designed to meet electrical, mechanical, and environmental performance requirements.
| Item | Requirements | Test Methods | Initial | After Test | Max. | Min. | Condition | Voltage | Current | Time |
|---|---|---|---|---|---|---|---|---|---|---|
| Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. | ||||||||
| Contact resistance (Low Level) | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. | 80 m | 100 m | 20 mV | 10 mA | |||||
| Insulation resistance | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B | 1000 M | Condition B | 500 V DC | ||||||
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. | 1.0 mA | 1 minute | 500 V AC | 1 minute | ||||
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate c` |
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