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| Categories | Memory Connectors |
|---|---|
| Card Type: | MicroSD Card |
| Model Number: | TFW11-N1S1-2000-A |
| Card Connection Mode: | Push-Push |
| Packaging Details: | SMD |
| Stock: | 100000 |
| Brand Name: | TFW11-N1S1-2000-A |
| Delivery Time: | 3-5 working days |
| Description: | Push-Push 1.8mm MicroSD Card SMD PC Card Sockets RoHS |
| MOQ: | 1000 |
| Height Above Board: | 1.8mm |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Function: T-Flash external welding card holder (non-aligned terminals) connector.
Usage: Used for connecting T-Flash devices with external welding capabilities.
Application: Suitable for electronic devices requiring T-Flash connectivity with external soldering.
| Item | Requirements | Test Methods |
|---|---|---|
| Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | (Implied by test sequence and requirements) |
| Parameter | Condition | Value |
|---|---|---|
| Storage Temperature | N/A | -25~+85 |
| Storage Relative Humidity | N/A | 80% |
| Solderability | MIL-STD-202F | Meets standard requirements |
| Wave Soldering Preheat | Max. temp increase rate | 4/sec |
| Wave Soldering Preheat | Final preheat temperature | Within 125 of solder temperature |
| Wave Soldering | Solder wave temperature | 2555 |
| Wave Soldering | Max. duration in solder wave | 5 seconds |
| Wave Soldering Cool Down | Ambient air temperature | 20 to 25 |
| Infrared Reflow Preheat | Max. temp increase rate | 4/sec |
| Infrared Reflow | Time above 183 | Max. 90 seconds |
| Infrared Reflow | Max. temperature | 260 |
| Infrared Reflow | Max. duration at max. temp | 10 seconds |
| Infrared Reflow Cool Down | Max. cooling rate | 6/sec |
| Cleaning (Aqueous) | Cycles | Three cycles |
| Cleaning (Aqueous) | Exposure time per cycle | Max. 1 minute |
| Cleaning (Aqueous) | Water temperature | 54 to 66 |
| Cleaning (Aqueous) | Max. pressure | 30 psi |
| Cleaning (Aqueous) Air Drying | Duration | 60 to 90 seconds |
| Cleaning (Aqueous) Air Drying | Air temperature | 93 to 121 |
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