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| Categories | Memory Connectors |
|---|---|
| Model Number: | MIS11-S1F1-2000-A |
| Stock: | 100000 |
| MOQ: | 1000 |
| Operating Temperature: | -25℃~+85℃ |
| Packaging Details: | SMD |
| Brand Name: | MIS11-S1F1-2000-A |
| Delivery Time: | 3-5工作日 |
| Description: | -25℃~+85℃ Push-Push 1.35mm MicroSIM Card SMD PC Card Sockets RoHS |
| Card Type: | MicroSIM Card |
| Height Above Board: | 1.35mm |
| Card Connection Mode: | Push-Push |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This specification covers performance, tests and quality requirements for SIM MEMORY CARD CONNECTOR. These connectors provide space savings and improved functionality to system signal transfer.
Key Features:
| Part No. | Description | Rating Current (per pin) | Contact Resistance (Max) | Dielectric Withstanding (AC Min) | Insulation Resistance (Min) | Mating Cycles | Operating Temperature | Material (Housing) | Material (Contact) | Material (Shell) | Finish (Contact Area) | Finish (Solder Tail) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MIS22-S1F1-2000-A( MICOR SIM PUSN (6+1PCD)) | SIM CARD INSERTED | 0.5A MAX. | 50 m MAX | 500V AC MIN. | 1000 M MIN. | 3000 CYCLES | -25 TO +85 | LCP S475 UL 94V-0 | C5191 | SUS304-H | GOLD FLASH PLATED ON CONTACT AREA | GOLD FLASH PLATED ON SOLDER TAILS |
| MIS11-S1F1-2000-A( MICOR SIM PUSN (6PCD)) | CD shell WITHOUT SIM CARD | 0.5A MAX. | 50 m MAX | 500V AC MIN. | 1000 M MIN. | 3000 CYCLES | -25 TO +85 | LCP S475 UL 94V-0 | C5191 | SUS304-H | GOLD FLASH PLATED ON CONTACT AREA | GOLD FLASH PLATED ON SOLDER TAILS |
| Test Description | Requirement | Condition | Reference Standard |
|---|---|---|---|
| Low-Signal Level Contact Resistance | R<100 m | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. | MIL-STD-202F, Method 302 |
| Insulation Resistance | R>1000 M | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. | MIL-STD-202F, Method 302 |
| Dielectric Withstanding Voltage | No discharge, flashover or breakdown. | 500 V initial and 250 Vfinal for 1 minute. | MIL-STD-202F, Method 301 |
| Retention Force | 100 Gram (0.98N) minimum (per pin) | Mate connector with a suitable gauge for each pin at rate of 25 mm/min. | MIL-STD-1344A, Method 2012.1 |
| Vibration | Discontinuity 1.0 microsec. MAX | Mate dummy card and subject to Vibration conditions for 2 hours in each of 3 axes. Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz. | MIL STD 202 Method 201 |
| Durability | 5000 cycles. | The sample should be mounted in the at the rate of 25mm/min. | MIL-STD-1344A, Method 2016 |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | Subject test area to flux for 30.5s, then into solder bath at 2705 for 30.5s. | N/A |
| Salt Spray | Oxidation of not more than 5% | Subject connectors to 51% salt-solution, 352 for 24 hours. | MTL-STD-1344A, Method 1001.1 |
| Temperature Life (Heat Aging) | A. Products in 852 96 hours, can still be used normally. B. Products in 2605 or eight reflow cycles (max 260), deformation not more than 0.12 mm. | A. 852 for 96 hours. B. 2605 or eight reflow cycles. | MTL-STD-202F, Method 108A |
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