ST VD55G4 MONO Global Shutter Camera Module , AR / VR , QR Code , Customization Services Available

ST VD55G4 MONO Global Shutter Camera Module , AR / VR , QR Code , Customization Services Available

1. Basic Parameters:

‑ Resolution: 804 (H) × 704 (V), 0.56MP. It supports RAW8 and RAW10 data output formats. The maximum frame rate can reach 184fps at full resolution, and stable continuous imaging at 10fps is available in low‑power mode.

‑ Pixel Size: 2.16μm (H) × 2.16μm (V). Compact in size, it is suitable for integration into various miniaturized devices.

‑ Optical Format: 1/9‑inch, monochrome visible‑to‑near‑infrared optical standard. Adopting an optical design with high quantum efficiency at 940nm, it delivers optimized imaging performance for near‑infrared scenarios and excellent light‑sensing capability in low‑light environments.

‑ Supply Voltage: Core voltage 1.1V, interface voltage 1.8V, analog voltage 2.8V. It can operate stably under various voltage conditions to ensure sensor reliability.

‑ Temperature Range: Operating temperature ranges from ‑30℃ to 85℃. The wide operating temperature range enables adaptation to diverse working environments.

2. Technical Features:

‑ Global Shutter Technology: The global‑shutter design effectively eliminates motion blur and illumination artifacts while reducing power consumption requirements for lighting.

‑ It adopts advanced integrated manufacturing processes including BSI back‑side illumination, CDTI and 3D stacking, paired with a native global‑shutter architecture. It completely avoids motion smear and distortion caused by rolling shutters, enabling accurate capture of high‑speed moving objects with extremely high dynamic imaging precision. Meanwhile, the built‑in ultra‑high dynamic range of 68dB preserves full details in both bright and dark scenes for outstanding imaging layering.

‑ Equipped with ST‑exclusive ultra‑low‑power BrightSense technology, it consumes only one‑tenth of the power of traditional comparable sensors under the normal‑working mode of 804×704 resolution and 10fps. Its proprietary always‑on low‑power mode supports long‑term standby imaging. It is ideal for battery‑powered portable and wearable devices and greatly extends device battery life.

‑ VD55G4 Camera Module: Compatible with standard modules with various lens configurations such as 80.9° to meet diverse customer requirements.

3. Application Fields:

Applied in virtual reality / augmented reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Customization Services:

Custom modules support customized production according to customer requirements to deliver tailor‑made products matching customer needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.