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| Categories | Standard PCB |
|---|---|
| Payment Terms: | L/C,D/A,D/P,T/T |
| Material: | TG130‑TG180 FR‑4 |
| Layers: | 2‑Layer‑Multilayer |
| Maxpanelsize: | 600mm x 600mm |
| Model Number: | Metal Edge Plated PCB |
| Operating Temperature: | -20°C to +130°C |
| Thermal Conductivity: | Enhanced via copper mass |
| Copperthickness: | 0.5‑6 OZ |
| MOQ: | 1PCS |
| Delivery Time: | 5‑15 work days, urgent order available |
| Testing: | 100% Electrical Test |
| Layer Count: | 1 – 48 layers |
| Price: | Negotiable |
| Silkscreencolor: | White |
| Certification: | ISO9001 |
| Supply Ability: | 20000 Square Meters |
| Surfacefinish: | HASL (Lead-Free),Immersion Gold (ENIG), Hard Gold Plating, Nickel Plating |
| Minimumtracespacing: | 6mil |
| Brand Name: | JQPCB |
| Dielectricconstant: | 4.5 |
| Packaging Details: | Vacuum packing + Anti‑static bag, Desiccant, Temperature indicator card, Carton box |
| Place of Origin: | China |
| Operatingtemperaturerange: | -40°C to 125°C |
| Productname: | Standard PCB |
| Boardthickness: | 0.6‑6.0mm |
| Company Info. |
| Shenzhen Jiaqing Circuit Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Metal Edge Plated PCB is a PCB with metallized copper plating along its cut profile edges. Its side‑edge conductors are electrically connected to surface copper foils to form complete side‑wall conductive barriers. Different from standard PCBs which only metallize top/bottom surfaces and through‑holes and leave bare substrate on board edges. It is widely applied for high‑current transmission, EMI shielding, grounding & heat dissipation, RF signal processing and connector contact applications.
✅ High‑current capacity: Side‑wall copper increases conductive cross‑section, ideal for high‑current power PCBs to shunt current and reduce impedance.
✅ Superior grounding & EMI shielding: Continuous grounding metal side‑walls enable direct contact grounding with enclosures and suppress electromagnetic interference, widely used for high‑frequency RF modules.
✅ Enhanced heat dissipation: Side‑wall metal assists heat transfer and improves overall PCB thermal diffusion.
✅ Mechanical contact conduction: Direct electrical connection via board edges with springs and connectors, eliminating extra connectors and simplifying mechanical structures.
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