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Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM

Categories Multilayer Printed Circuit Board
Model Number: XSWPCB
Material: Polyimide
MOQ: 1
Delivery Time: 8-15DAYS
Surface Finish: ENIG
Payment Terms: Western Union
Place of Origin: China
Copper Thickness: 4/2/2/2/2/2/2/2/2/2/2/2/2/4 oz
Supply Ability: 1 Million Square feet/per month
Certification: UL ,IOS9000
Board Thickness: 1.5 mm (Customizable)
Price: Negotiable
Brand Name: XSW PCB
Layer Count: 14-Layer
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Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM

Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM


Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM is a high-performance PCB manufacturing solution designed for applications requiring exceptional thermal resistance, high current capacity, mechanical durability, and long-term reliability. Utilizing premium Polyimide (PI) substrate materials combined with thick copper technology, this multilayer PCB is ideal for power electronics, industrial automation, aerospace systems, electric vehicles, renewable energy equipment, and other mission-critical applications.


Key Specifications
Layer Count14-Layer
MaterialPolyimide
Board Thickness1.5 mm (Customizable)
Copper Thickness4/2/2/2/2/2/2/2/2/2/2/2/2/4 oz
Minimum Hole Size0.2 mm
Minimum Line Width0.25 mm
Minimum Line Spacing0.25 mm
Solder Mask ColorGreen
Surface FinishENIG

Product Description

Premium Polyimide Substrate Material

  • Excellent thermal resistance and dimensional stability.
  • Superior performance in high-temperature environments.
  • Ideal for aerospace, automotive, and industrial applications.

Thick Copper Technology

  • Enhanced current-carrying capability.
  • Reduced conductor resistance and voltage drop.
  • Suitable for high-power electronic systems.

Multilayer PCB Construction

  • Supports complex circuit architectures.
  • Improved signal routing and power distribution.
  • High-density design capability.

Outstanding Thermal Management

  • Efficient heat dissipation for power-intensive applications.
  • Improved reliability under continuous operation.
  • Reduced thermal stress on components.
  • Design Specifications
ItemMass Production CapabilityExtreme Capability
Board Thickness Range0.3~6.0mm0.3~6.0mm
Exposure Alignment Accuracy±0.015mm±0.005mm
Minimum Annular RingSingle side ≥0.05mmSingle side ≥0.05mm
Min Line Width/Space (1/3oz base copper)0.05mm / 0.05mm0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)0.05mm / 0.05mm0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)0.075mm / 0.075mm0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)±0.005mm±0.005mm
Etching Tolerance (1/2oz base copper)±0.005mm±0.005mm
Etching Tolerance (1oz base copper)±0.0075mm±0.0075mm
Gold Finger Total Pitch Tolerance<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
Quality Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM for sale
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