10 Layer Server PCB FR4 TG150 ENIG 2.0mm PCB Assembly Services

Categories	Server PCB
Model Number:	XSWPCB
Material:	FR4 TG150
MOQ:	1
Delivery Time:	8-15DAYS
Surface Finish:	ENIG
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month
Certification:	UL ,IOS9000
Board Thickness:	2.0 mm (Customizable)
Place of Origin:	China
Copper Thickness:	2/1/1/1/1/1/1/1/1/2 oz
Price:	Negotiable
Brand Name:	XSW PCB
Layer Count:	10-Layer

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Shenzhen Xunsiwei Circuit Co., Ltd.

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10 Layer Server PCB FR4 TG150 ENIG 2.0mm PCB Assembly Services

10 Layer FR4 TG150 ENIG 2.0mm PCBA Board for Server

10 Layer FR4 TG150 ENIG 2.0mm PCBA Board for Server is a high-reliability multilayer PCB assembly solution specifically designed for servers, data centers, storage systems, networking equipment, cloud computing infrastructure, and enterprise-class computing platforms. Built with 10-layer FR4 TG150 material, 2.0mm board thickness, and a premium ENIG (Electroless Nickel Immersion Gold) surface finish, this PCBA delivers excellent signal integrity, thermal stability, power distribution, and long-term operational reliability.

Key Specifications

Layer Count	10-Layer
Material	FR4 TG150
Board Thickness	2.0 mm (Customizable)
Copper Thickness	2/1/1/1/1/1/1/1/1/2 oz
Minimum Hole Size	0.2 mm
Minimum Line Width	0.2 mm
Minimum Line Spacing	0.2 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

10-Layer High-Density PCB Design

Advanced 10-layer stack-up for complex server architectures.
Dedicated signal, power, and ground planes.
Supports high-speed computing and networking applications.

FR4 TG150 High-Tg Material

Glass transition temperature (Tg) of 150°C.
Excellent thermal stability and dimensional control.
Suitable for high-power and continuous-operation environments.

2.0mm Heavy-Duty Board Thickness

Enhanced mechanical strength and rigidity.
Improved resistance to warping and deformation.
Ideal for large server motherboard applications.

Premium ENIG Surface Finish

Excellent solderability and oxidation resistance.
Flat surface for BGA, CPU, and memory device assembly.
Improved long-term reliability of solder joints.

Superior Signal Integrity

Optimized for high-speed server communication.
Reduced signal loss, EMI, and crosstalk.
Supports PCIe, DDR memory, Ethernet, and high-speed interfaces.

High Current Carrying Capability

Optimized power plane design.
Stable power delivery to processors and critical components.
Suitable for high-performance computing systems.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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