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Custom Multilayer PTFE High Frequency Printed Circuit Board For 5G Base Station RF Module

Categories High Frequency Printed Circuit Board
Model Number: XSWPCB
Material: PTFE
MOQ: 1
Delivery Time: 8-15DAYS
Surface Finish: ENIG
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Certification: UL ,IOS9000
Board Thickness: 2.0 mm (Customizable)
Place of Origin: China
Copper Thickness: 1/1/1/1/1/1/1/1 oz
Price: Negotiable
Brand Name: XSW PCB
Layer Count: 8-Layer
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Custom Multilayer PTFE High Frequency Printed Circuit Board For 5G Base Station RF Module

Custom Multilayer PTFE High Frequency PCB Board For 5G Base Station RF Module


This custom multilayer PTFE high frequency PCB is engineered for 5G base station RF front-end modules, phased array antennas and microwave signal transmission. Adopting high-performance PTFE (Teflon) dielectric substrate, the circuit board features ultra-low dielectric constant (Dk) and extremely low dissipation factor (Df), effectively reducing insertion loss and signal distortion under GHz & millimeter wave frequency bands.

Key Specifications
Layer Count8-Layer
MaterialPTFE
Board Thickness2.0 mm (Customizable)
Copper Thickness1/1/1/1/1/1/1/1 oz
Minimum Hole Size0.1 mm
Minimum Line Width0.1 mm
Minimum Line Spacing0.1 mm
Solder Mask ColorGreen
Surface FinishENIG

Product Description

1.Premium PTFE base material, ultra-low Dk & Df, minimum signal attenuation at microwave & mmWave frequency
2.Custom multilayer structure available, support hybrid stack-up of PTFE + FR4 composite boards
3.Strict impedance control (50Ω/75Ω etc.), consistent impedance tolerance for RF transmission lines
4.Excellent dielectric stability, Dk barely fluctuates with temperature and frequency changes
5.Low moisture absorption, outstanding chemical resistance and wide operating temperature range
6.Adopt LDI laser direct imaging technology, high precision fine trace & space manufacturing
7.Multiple surface treatment options: Immersion gold, hard gold, HASL, OSP to meet soldering requirements
8.Low dielectric loss, greatly improve transmission efficiency of 5G RF & microwave signals

  • Design Specifications
ItemMass Production CapabilityExtreme Capability
Board Thickness Range0.3~6.0mm0.3~6.0mm
Exposure Alignment Accuracy±0.015mm±0.005mm
Minimum Annular RingSingle side ≥0.05mmSingle side ≥0.05mm
Min Line Width/Space (1/3oz base copper)0.05mm / 0.05mm0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)0.05mm / 0.05mm0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)0.075mm / 0.075mm0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)±0.005mm±0.005mm
Etching Tolerance (1/2oz base copper)±0.005mm±0.005mm
Etching Tolerance (1oz base copper)±0.0075mm±0.0075mm
Gold Finger Total Pitch Tolerance<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
Quality Custom Multilayer PTFE High Frequency Printed Circuit Board For 5G Base Station RF Module for sale
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