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ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
Categories Waffle Pack Chip Trays
Model Number: HN24194
Mold Type: Injection
Capacity: 17x24=408 PCS
Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Quality Assurance: Delivery Guarantee, Reliable Quality
Certification: ROHS, ISO
Ic Type: BGA,QFP,QFN,LGA,PGA
Packing Level: Transport package
Warpage: Warpage MAX 0.22mm
MOQ: 1000
Delivery Time: 10 workdays
Incoterms: EXW, FOB, CIF, DDU, DDP
Payment Terms: T/T
Color: Black
Cavity Size: 1.58x0.85x0.7 mm
Outline Line Size: 50.7×50.7×4 mm
Supply Ability: 2000PCS/Day
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Tray Shape: Rectangular
Brand Name: Hiner-pack
Reusable: Yes
Packaging Details: CARTON, PALLET
Place of Origin: China
Clean Class: General And Ultrasonic Cleaning
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Company Info.
Shenzhen Hiner Technology Co., Ltd.
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ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
Deliver precise waffle structure to cradle delicate IC chips tightly, preventing movement and electrostatic damage during handling. Crafted from durable anti-static material to maintain consistent performance in industrial environments, offering reliable protection for sensitive semiconductor components.

Integrate seamlessly with automated production lines and clean manufacturing workflows, performing steadily in chip loading, transfer, and inventory management procedures. Adapt flexibly to diverse semiconductor manufacturing scenarios, supporting efficient production and logistics operations.

Support full customization of cavity size and layout to match unique chip dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard IC chips throughout transit and storage.
Key Features/ Benefits
  • Durable construction
  • Precision cavity layout
  • Durable construction
  • Secure chip holding
  • ESD-safe protection
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
BrandHiner-pack
ModelHN24194
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size50.7×50.7×4 mm
Cavity Size1.58x0.85x0.7 mm
Matrix QTY17x24=408 PCS
WarpageMAX 0.22mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Suitable for high-precision chip processing, component sorting, device testing, and small device assembly. Work well in automatic production lines and static-controlled workshops.

Ideal for factory internal transportation, finished product storage, and cross-regional goods delivery. Widely used in chip manufacturing, packaging plants, and electronic component suppliers.
Customized Services
Provide fully customized solutions for waffle pack chip trays. Adjust cavity size, spacing, and layout to fit diverse chip dimensions.

Leverage durable anti-static material for enhanced protection. Offer prototype testing and personalized design support to meet unique production and packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
Product Tags:

ESD-safe waffle pack chip trays

  

semiconductor storage waffle trays

  

waffle pack trays for chips

  
Quality ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage for sale

ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

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