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| Categories | Waffle Pack Chip Trays |
|---|---|
| MOQ: | 1000 |
| Delivery Time: | 10 workdays |
| Incoterms: | EXW, FOB, CIF, DDU, DDP |
| Place of Origin: | China |
| Clean Class: | General And Ultrasonic Cleaning |
| Packing Level: | Transport package |
| Warpage: | Warpage MAX 0.23mm |
| Price: | $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities) |
| Quality Assurance: | Delivery Guarantee, Reliable Quality |
| Supply Ability: | 2000PCS/Day |
| Tray Weight: | Varies, Typically Up To 500 Grams Per Cavity |
| Outline Line Size: | 101.6×101.6×7 mm |
| Certification: | ROHS, ISO |
| Model Number: | HN25249 |
| Mold Type: | Injection |
| Capacity: | 4×7=28 PCS |
| Payment Terms: | T/T |
| Color: | Black |
| Cavity Size: | 20.25×10×0.1 mm |
| Tray Shape: | Rectangular |
| Ic Type: | BGA,QFP,QFN,LGA,PGA |
| Brand Name: | Hiner-pack |
| Reusable: | Yes |
| Packaging Details: | CARTON, PALLET |
| Company Info. |
| Shenzhen Hiner Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Searching for reliable carrier for fragile IC parts? Hold tiny chips firmly inside neatly molded cavities. Block static charge buildup and avoid sudden electrostatic harm across production links. Keep every single component fixed without shifting during movement.
Feature rigid flat panel design with evenly arranged pockets. Fit
automated test fixtures and pick place equipment perfectly. Cut
abrasion and collision risk during repeated handling, inspection
and transfer. Maintain consistent performance after long time
circulation.
Accept custom cavity shapes depths and overall tray dimensions.
Adjust layout to match unique chip outlines and footprint. Support
small batch and mass production projects. Meet diverse requirements
from electronic and semiconductor manufacturers.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 101.6×101.6×7.8 mm | ||
| Matrix QTY | 4×7=28 PCS | ||
| Service | Accept OEM, ODM | ||
Support semiconductor production and chip testing workflows. Carry ICs while sorting and quality checking. Enable smooth part circulation inside workshops and assembly lines.
Fit electronic parts warehouse keeping. Support bulk chip outbound
transport. Preserve component integrity before final assembly and
packaging.
Pack inside anti static bags then export cartons. Proper stacking avoid surface marks. Provide various shipping choices. Track shipments after sending. Ensure safe arrival to worldwide clients.
Why Choose Us:
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