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Precision Engineered Solid PC Waffle Pack Chip Trays with ESD Protection for IC Chip Trays

Categories Waffle Pack Chip Trays
MOQ: 1000
Delivery Time: 10 workdays
Incoterms: EXW, FOB, CIF, DDU, DDP
Place of Origin: China
Clean Class: General And Ultrasonic Cleaning
Packing Level: Transport package
Warpage: Warpage MAX 0.23mm
Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Quality Assurance: Delivery Guarantee, Reliable Quality
Supply Ability: 2000PCS/Day
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Outline Line Size: 101.6×101.6×7 mm
Certification: ROHS, ISO
Model Number: HN25249
Mold Type: Injection
Capacity: 4×7=28 PCS
Payment Terms: T/T
Color: Black
Cavity Size: 20.25×10×0.1 mm
Tray Shape: Rectangular
Ic Type: BGA,QFP,QFN,LGA,PGA
Brand Name: Hiner-pack
Reusable: Yes
Packaging Details: CARTON, PALLET
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Precision Engineered Solid PC Waffle Pack Chip Trays with ESD Protection for IC Chip Trays

Precision Engineered Waffle Pack Chip Trays Solid PC for ESD Protection

Searching for reliable carrier for fragile IC parts? Hold tiny chips firmly inside neatly molded cavities. Block static charge buildup and avoid sudden electrostatic harm across production links. Keep every single component fixed without shifting during movement.


Feature rigid flat panel design with evenly arranged pockets. Fit automated test fixtures and pick place equipment perfectly. Cut abrasion and collision risk during repeated handling, inspection and transfer. Maintain consistent performance after long time circulation.


Accept custom cavity shapes depths and overall tray dimensions. Adjust layout to match unique chip outlines and footprint. Support small batch and mass production projects. Meet diverse requirements from electronic and semiconductor manufacturers.

Key Features/ Benefits
  • Precision shaped molded cavities
  • Precision shaped molded cavities
  • Anti scratch anti contamination
  • Anti scratch anti contamination
  • Black and red color option
Specifications
BrandHiner-pack
ModelHN25249
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size101.6×101.6×7.8 mm
Cavity Size20.25×10×0.1 mm
Matrix QTY4×7=28 PCS
WarpageMAX 0.23mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications

Support semiconductor production and chip testing workflows. Carry ICs while sorting and quality checking. Enable smooth part circulation inside workshops and assembly lines.


Fit electronic parts warehouse keeping. Support bulk chip outbound transport. Preserve component integrity before final assembly and packaging.

Packaging & Shipping/ Services

Pack inside anti static bags then export cartons. Proper stacking avoid surface marks. Provide various shipping choices. Track shipments after sending. Ensure safe arrival to worldwide clients.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
Quality Precision Engineered Solid PC Waffle Pack Chip Trays with ESD Protection for IC Chip Trays for sale
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