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TIF100-20-11U Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU

Categories Thermal Pad
Brand Name: Ziitek
Model Number: TIF100-20-11U
Certification: RoHS
Place of Origin: Vietnam
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU
Materials: Ceramic filled silicone elastomer
Thermal conductivity: 2.0W/mK
Color: Dark Gray
Hardness: 27 (Shore 00)
Specific Gravity: 2.7 g/cc
Keywords: Thermal pad
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TIF100-20-11U Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU

TIF100-20-11U Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU


Product descriptions


TlF100-20-11U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features


>Good thermal conductivity: 2.0 W/mK
>Naturally tacky needing no further adhesive coating
>Soft and Compressible for low stress applications
>Available in varies thickness


Application


>Cooling components to thechassis of frame
>Set Top Box
>Car Battery & Power Supply
>Charging Pile
>LED Tv/ Lighting
>Graphics Card Thermal Module


Typical Properties of TIF100-20-11U Series
ColorDark grayVisual
Construction & CompostionCeramic filled silicone elastomer******
Thickness range0.020“(0.5mm~0.200"(5.0mm”)ASTM D374
Hardness27(Shore 00)ASTM 2240
Specific Gravity2.7 g/ccASTM D297
Continuos Use Temp(℃)-40~160******
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant@ 1MHz3.5ASTM D150
Volume Resistivity7.3X1013 Ohm-meterASTM D257
Thermal conductivity2.0W/m-KASTM D5470
Outgassing (TML)0.37%0ASTM E595
Flame Rating94 V-0UL E331100

Prodducts specification


Standard Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm), Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Vietnam Ziitek Technology Company Limited is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Quality TIF100-20-11U Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU for sale
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