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6800W Laptop BGA Machine WDS-750 220V Infrared For Chips Repairing

Categories BGA Reballing Machine
Brand Name: WDS
Model Number: WDS-750
Certification: CE ISO
Place of Origin: China
MOQ: 1 UNIT
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 150 UNITS PER MONTH
Delivery Time: 8-15 working days
Packaging Details: Wooden case
Rated Capacity: 6800W
Use: Repair BGA chip
Dimensions: L830*W670*H850mm
Weight: 75KG
PCB size: Max 570*480mm Min 10*10 mm
BGA Chip: Max 80*80mm,Min 1*1mm
Heating power: Upper hot air:1200W,Lower hot air:1200W,IR zone:4200W
After-sales Service Provided: Free spare parts
Warranty: 1 Year
Voltage: 220V/110V
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6800W Laptop BGA Machine WDS-750 220V Infrared For Chips Repairing

WDS-750 Optical Alignment BGA Rework Station High temperature control system


Features:

1.Touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use;



2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield;



3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling;



4.Auto feed chip,auto pick up chip,auto blowing chip,can identify the central position automatically when optical alignment;



5.Multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users;



6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 ℃;



7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm;



8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users;



9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts;



10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional).



WDS-750 parameter:

Total power6800W
Upper heating power1200W
Bottom heating power1200W
Bottom IR heating power4200W(2400W is controlled)
Power supply(Single Phase) AC 220V±10 50Hz
Location wayOptical camera+ V-shape card slot + laser position for fast location
Temperature controlHigh precision K sensor closed loop control,independent temperature control with ±1 ℃ precision
Appliance selectionHigh sensitive touch screen + temperature control mode +Panasonic PLC +step driver
Max. PCB size550×480mm
Min. PCB size10×10mm
Sensor4units
Chip amplification multiple1-200X
PCB thickness0.5-8mm
Chip size0.2*0.4mm-9cm
Min. chip space0.15mm
Max. mount loading100G
Mount precision±0.01mm
Overall sizeL670×W770×H900mm
Optical cameraCan be removed front and back,left and right,prevent the dead angle
Machine weight90kg

Quality 6800W Laptop BGA Machine WDS-750 220V Infrared For Chips Repairing for sale
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