F4BTM298 High Frequency PCB 3.0mm Substrates RF PCB Board With Immersion Tin for sale of circuitboardpcbs

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F4BTM298 High Frequency PCB 3.0mm Substrates RF PCB Board With Immersion Tin

F4BTM298 High Frequency PCB 3.0mm Substrates RF PCB Board With Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General description

This is a type of double sided high frequency PCB built on 3.0mm F4BTM298 substrate for the application of Patch Antenna.

Basic specifications

Base material: F4BTM298

Dielectric constant: 2.98+/-0.06

Layer count: 2 layers

Type: Through holes

Format: 110mm x 35mm = 1 type = 1 piece

Surface finish: Immersion tin

Copper weight: Outer layer 35 μm

Solder mask / Legend: No / No

Final PCB height: 3.1 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months

Applications

Multiplexer, Acoustic Detection Sensors, Radio Frequency, RF Transceiver

F4BTM High Frequency Laminates

F4BTM series high frequency materials are made of glass fiber cloth, nano-ceramic filling and polytetrafluoroethylene resin after scientific preparation and strict process pressing.

This series of products is based on the F4BM dielectric layer, and the materials are added with high-dielectric and low-loss nanoscale ceramics, thus obtaining higher dielectric constant, better heat resistance, lower coefficient of thermal expansion, higher insulation resistance, better thermal conductivity, while maintaining the characteristics of low loss.

Our PCB Capability (F4BTM)

PCB Material:	PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTM )	F4BTM	DK (10GHz)	DF (10 GHz)
	F4BTM298	2.98±0.06	0.0018
	F4BTM300	3.0±0.06	0.0018
	F4BTM320	3.2±0.06	0.0020
	F4BTM350	3.5±0.07	0.0025
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness)	0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

Data Sheet (F4BTM)

Product Technical Parameters				Product Models & Data Sheet
Product Features		Test Conditions	Unit	F4BTM298	F4BTM300	F4BTM320	F4BTM350
Dielectric Constant (Typical)		10GHz	/	2.98	3.0	3.2	3.5
Dielectric Constant Tolerance		/	/	±0.06	±0.06	±0.06	±0.07
Loss Tangent (Typical)		10GHz	/	0.0018	0.0018	0.0020	0.0025
Loss Tangent (Typical)		20GHz	/	0.0023	0.0023	0.0026	0.0035
Dielectric Constant Temperature Coefficient		-55 º~150ºC	PPM/℃	-78	-75	-75	-60
Peel Strength		1 OZ F4BTM	N/mm	>1.6	>1.6	>1.6	>1.6
Peel Strength		1 OZ F4BTME	N/mm	>1.4	>1.4	>1.4	>1.4
Volume Resistivity		Standard Condition	MΩ.cm	≥1×10^7	≥1×10^7	≥1×10^7	≥1×10^7
Surface Resistivity		Standard Condition	MΩ	≥1×10^6	≥1×10^6	≥1×10^6	≥1×10^6
Electrical Strength (Z direction)		5KW,500V/s	KV/mm	>26	>30	>32	>32
Breakdown Voltage (XY direction)		5KW,500V/s	KV	>34	>35	>40	>40
Coefficientof Thermal Expansion	XY direction	-55 º~288ºC	ppm/ºC	15,16	15,16	13,15	10,12
Coefficientof Thermal Expansion	Z direction	-55 º~288ºC	ppm/ºC	78	72	58	51
Thermal Stress		260℃, 10s,3 times		No delamination	No delamination	No delamination	No delamination
Water Absorption		20±2℃, 24 hours	%	≤0.05	≤0.05	≤0.05	≤0.05
Density		Room Temperature	g/cm3	2.25	2.25	2.20	2.20
Long-Term Operating Temperature		High-Low Temperature Chamber	℃	-55～+260	-55～+260	-55～+260	-55～+260
Thermal Conductivity		Z direction	W/(M.K)	0.42	0.42	0.50	0.54
PIM		Only applicable to F4BTME	dBc	≤-160	≤-160	≤-160	≤-160
Flammability		/	UL-94	V-0	V-0	V-0	V-0
Material Composition		/	/	PTFE, Fiberglass Cloth, nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

F4BTM298 High Frequency PCB 3.0mm Substrates RF PCB Board With Immersion Tin

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