| Sign In | Join Free | My carsrow.com |
|
| Sign In | Join Free | My carsrow.com |
|
| Categories | AOI Tester |
|---|---|
| Brand Name: | MENTO |
| Model Number: | S2020 |
| Certification: | FCC.ROHS,CCC |
| Place of Origin: | DONGGUAN |
| MOQ: | 1 |
| Supply Ability: | 10pcs+20 work days |
| Delivery Time: | 20 work days |
| Packaging Details: | 1200mm*1500mm*1800mm |
| Inspection Type: | 2D and 3D |
| Lighting Source: | UV and white light |
| Inspection Accuracy: | ±3μm |
| Inspection Resolution: | 10μm |
| Power Supply: | AC 100-240V, 50/60Hz |
| Software Platform: | Windows |
| Inspection Range: | Up to 510mm x 510mm |
| Dimensions: | 1000mm x 1000mm x 1500mm |
| Usage: | Automated Optical Inspection |
| Inspection Speed: | Up to 1200mm/s |
| Lighting Type: | LED |
S2020 Semiconductor wire bonding inspection
| Device model | S2020 | ||
| Detection capacity | Detection items | Wire bonding inspection | |
| Detection type | Ball size, solder offset, solder bridging, miss planting ball, particle, solder overlap, solder break, , welding wrong wire, wire break, wire collapse, wire bridging, wire residue, welding wire interleaving | ||
| Optical system | Camera | 20MP | |
| Telecentric lens | telecentric optical lens | ||
| Resolution | 4um(2.4um~4um optional) | ||
| illuminant | RGB(can be customized) | ||
| Efficiency | 3FOV/s | ||
| Software system | Operating system | Ubuntu | |
| Computer configuration | Host | CPU: Inteli7, RAM: DDR4-128G, GPU: GTX1660-6GB SSD:250G, HDD: 2T | |
| Monitor | 22"LED | ||
| Operating system | Ubuntu | ||
| Detection performance | PCB Thickness | 1~5mm | |
| Component Height | 20mm upper, 30mm lower (special height can be customized) | ||
| Driving equipment | Linear motor + grating ruler | ||
| Moving speed | Max:600mm/s | ||
| PCB transport rail | 900+20mm (from the ground to the fixture surface) | ||
| Parameters | PCB size | Max:350mmx300mm | Max:370mmx350mm |
| Power | AC220V/50Hz/2000W | ||
| Overall size | W1120xD980xH1600 mm | ||
| Weight | ≈800KG | ||
| Air pressure requirements | ≥0.5Mpa | ||
| Environmental requirements | Temperature: 5~40℃, relative humidity 25%~80% (no frost) | ||
| Upstream and downstream equipment communication | Standard SMEMA interface/data communication with die bonding machine | ||
Scientific platform design
Grinding grade motion track design
High repeatability and positioning accuracy, low noise
High-precision motion control system design
Avoid motion system data loss, ensure high-speed and stable operation, and effectively improve motion acceleration and deceleration.
Overall casting structure
Effectively ensure the stability of the continuous operation of the equipment.
Inspection Items
Gold Wire Inspection:Ball size, solder offset, solder bridging, miss planting ball, particle, solder overlap, solder break, , welding wrong wire, wire break, wire collapse, wire bridging, wire residue, welding wire interleaving.
Core inspection: offset, rotation, particle, scratches, reverse and so on.
|
Used Automated Optical Inspection AOI Tester Machine For CHIP DIP Detection K2005DT
Accurate Machine AOI Automatic Visual Inspection ODM
ODM Optical Inspection AOI Tester SPI SMT Machine
Customizable AOI Device Equipment Manufacturers Industrial Camera
RGB AOI Tester Automatic Inspection Machine Standard SMEMA interface
AOI Visual Automated Inspection Machine For PCB 60Hz
Accurate AOI Tester PCB Automatic Optical Inspection Equipment
AOI Auto Visual Inspection Machine For Wafer PCB Defect Testing
Windows OS AOI Tester Inspection PCB Inspection Machine 2D 3D
M2020 AOI Automated Visual Inspection Equipment In SMT
