Prototyping 1.6mm Thickness SMT PCBA Assembly 2 Layers Electronic Components

Prototyping 1.6mm Thickness SMT PCBA Assembly 2 Layers Electronic Components

PCB Board SMT PCBA Assembly Assembly Electronic Components SMT PCB Assembling PCBA Prototyping

One-stop PCB/PCBA OEM Service

If desired, we will source, organize and manage all aspects of the PCB design, so that your product meets all required standards and is fully optimized for easy and cost-effective manufacturing.

A well-designed circuit board means:
· A reduction in production problems
· Improved quality control
· Reduced costs
· Reduced manufacturing times

We work to supply small and large batches of competitively priced printed circuit boards to our customers.

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Leadsintec Co., Ltd is an electronics manufacturing service (EMS) provider located in Shenzhen China since 2004. As an ISO 9001 certified electronics contract manufacturer, we offer a full range of PCB, component procurement, PCB assembly, box-build, testing, cables, and accessories services.

Owing to the past over 15 years of rich experience in manufacturing, Leadsintec has gained a fine reputation at home and abroad. Our products are mainly applied in the Consuming, Industrial, Automation, Automotive, Agriculture, Defense & Aerospace, Medical and Security markets.

Our commitment is to assist small and mid-sized customers in reducing their costs by providing total solutions, high-mixed, low, and medium volume services. With our skilled program managers, process engineers, production personnel, and procurement professionals, we are capable to fully understand and surpass your requirements.

Leadsintec’s manufacturing facilities include clean workshops and advanced high-speed SMT lines. Our chip placement precision can reach +0.1MM on integrated circuit parts. It means we can deal with almost all kinds of integrated circuits, such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA. Additionally, we can provide 0201 chip placement, through-hole component insertion, and finished product fabrication, test, and packing.