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Edgebanding Polyurethane Hot Melt Adhesives Foam PUR Hot Glue Particle Chip Density Aluminum PUR-XCS637

Categories PUR Hot Melt Adhesives
Brand Name: WANLI-ADHESION
Model Number: PUR-XCS637
Certification: ISO9001 ISO14001 IATF16949
Place of Origin: CHINA
MOQ: 20 KG
Payment Terms: L/C, T/T
Delivery Time: 5-8 work days
Packaging Details: 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel
Product: PUR Hot Melt Adhesive
Component: PUR (Polyurethane)
Appearance: Ivory Solid
Solid Content: 100%
Shelf Life: 6 Months
Melt Viscosity: About 55000mPa·s@120℃
Operating Temperature: 120 ~140 ℃
Open Time: 10~15s@25℃
Useage Scope: Edge Bonding of Wood Material s- Chip Board
Application Industry: Woodworking Edgebanding
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Edgebanding Polyurethane Hot Melt Adhesives Foam PUR Hot Glue Particle Chip Density Aluminum PUR-XCS637

Single-component reactive adhesive PUR-XCS637 is colorless transparent after melting and suitable for edgebanding application of all colors substrates. It can cure within short time at room temperature and provide an invisible bondline due to their colorless appearance to meet end customer demands on perfect glueline.


Wanli® PUR hot melt adhesive PUR-XCS637 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XCS637 is a translucent natural color edge bonding glue, which is mainly used for edge bonding of solid wood materials, density boards, foam boards, particleboards and other substrates. PUR-XCS637 is featured high initial tack, short open time, high bond strength.

APPLICATION
Wanli® PUR hot melt adhesive PUR-XCS637 is used for edge bonding. PUR-XCS637 is mainly used edge bonding of solid wood materials, density boards, foam boards, particleboards and other substrates.


Application MaterialWoodworking Edgebanding Hot Melt Adhesives
AppearanceIvory Solid
ComponentPUR (Polyurethane)
Application IndustryWoodworking Edgebanding
Solid Content100%
Operating Temperature120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt ViscosityAbout 55000mPa·s@120℃(Brookfield-ASTMD3236)
Open Time10~15s@25℃
Usage ScopeEdge Bonding of Wood Materials - Chip Board
Shelf Life6 Months
Package500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel


FEATURE
High initial tack.
Short open time.
High bond strength.

USER GUIDE
The package of PUR-XCS637 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.

STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.


Quality Edgebanding Polyurethane Hot Melt Adhesives Foam PUR Hot Glue Particle Chip Density Aluminum PUR-XCS637 for sale
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