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| Categories | PCB Laser Cutting Machine | 
|---|---|
| Brand Name: | Genitec | 
| Model Number: | ZMLS5000DP | 
| Certification: | CE, RoHS | 
| Place of Origin: | China | 
| MOQ: | 1 set | 
| Price: | USD2000-90000 | 
| Payment Terms: | L/C, T/T, Western Union, MoneyGram | 
| Supply Ability: | 500 sets per Month | 
| Delivery Time: | 5-45 days | 
| Packaging Details: | Vacuum packed in wooden cases | 
| Product Name: | PCB Laser Cutting Machine | 
| Model: | ZMLS5000DP | 
| Machine Size: | 1680*1650*1800mm | 
| Product Weight: | 2000KG | 
| Voltage: | Single Phase AC220V/3KW | 
| Laser source: | PS Laser/NS Laser | 
| Processing size: | 650mm*650mm | 
| Laser power: | 15W/20W (Optional) | 
| Company Info. | 
| GENITEC DONGGUAN CO.,LTD | 
| View Contact Details | 
| Product List | 
Multi Plate Cutting 355nm PCB Laser Cutting Machine With Automatic Positioning Function
Laser PCB Separator PCB Laser Cutting Machine Fully Automatic Positioning
PCB Laser Cutting Machine Description:
1. with control software with independent intellectual property rights, user-friendly interface, complete functions, simple operation;
2. can process any graphics, cutting different thicknesses and
different materials can be processed and the synchronization is
complete hierarchical; optical system design optimization to ensure
high beam quality, reduce the focused spot size, to ensure
precision;
3. using high-performance UV laser with wave length, high beam
quality, higher peak power characteristics. Due to ultraviolet
light through decomposition, vaporization rather than melting
materials processing to achieve, so almost no post-processing
glitches, small thermal effect, no points layer, the effect of
cutting precision, smooth, steep sidewalls.
4. using vacuum fixed sample, no mold protection plate is fixed,
convenient, improve processing efficiency.
5. can cut a variety of substrate materials, such as: silicon,
ceramic, glass and the like.
6. automatic correction, automatic positioning function,
multi-plate cutting, automatic thickness measurement and
compensation, motor Bank and compensation, working better
uniformity and small machining depth fluctuations, higher
processing efficiency of complex graphics.
FPC UV laser cutting machine, FPC laser cutting machine Technical
parameters:
Solid-state UV laser source laser wavelength: 355nm
| Item | ZMLS6500 | ZMLS5000DP | ZMLS5000DP-A | ZMLS6000DP-A | 
| Machine size(L*W*H) | 1520*1720*1600mm | 1680*1650*1800mm | 1650*1550*1700mm | 1350*1150*1550mm | 
| Weight | 2000KG | 1500KG | ||
| Power supply | Single Phase AC220V/3KW | |||
| Laser source | PS Laser/NS Laser | NS Laser | ||
| Laser power | 15W/30W (Optional) | 15W/20W (Optional) | ||
| Material thickness | ≦1.6mm (According to material) | |||
| Whole machine precision | ±20 μm | |||
| positioning precision | ±2 μm | |||
| Repeat precision | ±2 μm | |||
| Processing size | 650mm*650mm | 350mm*450mm*2 | 500mm*550mm | |
| Focus spot diameter | 20 ± 5 μm | |||
| Environment temperature/humidity | 20±2 °C/<60% | |||
| Machine tool body | Marble | |||
| Galvanometer system | Original imported | |||
| Motion controlling system | Original imported | |||
| Formats | Gerber,DXF, ASCII, Excellon I and II, sieb&Meier | |||
| Necessary hardware and software | Including PC and CAM software | |||
| Working mode | Manual loading and unloading | Automatic loading and unloading cutting processing | Manual loading and unloading | |
PCB Laser Cutting Machine Features
1. MicroScan5000DP laser cutting machine, dual platform, greatly
improve production efficiency, is specially designed for FPC and
PCB processing equipment.
2. Efficient and fast FPC/PCB shape cutting, drilling and covering
film window opening, fingerprint identification chip cutting, TF
memory card board, mobile phone camera module cutting and other
applications.
3. Block, layer, designated block or selected area cutting and
direct molding, cutting edge neat round, smooth no burr, no glue
overflow.The product can be arranged in multiple matrix for
automatic positioning and cutting, especially suitable for fine,
difficult, complex patterns and other shapes of cutting.
4. High performance laser: the use of international first-line
brand solid-state ultraviolet laser/green laser, with good beam
quality, focusing spot small, power distribution uniform, small
thermal effect, slit width small, cutting quality high advantages
is the guarantee of perfect cutting quality.
5. Fast and high precision: the combination of high precision, low
drift vibroscope and fast coreless linear motor system enables fast
cutting while maintaining high precision on the micron scale.
6. Fully automatic positioning: the use of high-precision CCD
automatic positioning, focusing, so that the positioning fast,
accurate and high precision, without manual intervention, simple
operation, to achieve the same type of one-button mode, greatly
improve the production efficiency.
7. Waste gas treatment system: suction system can eliminate all
cutting waste gas, avoid the harm to the operator and environmental
pollution.
8. High degree of automation: vibration mirror automatic
correction, automatic focus, the whole process of automation, the
use of laser displacement sensor to automatically adjust the height
of the focus to the table, to achieve rapid alignment, save time
and worry.
9. Simple and easy to learn software: independently developed
control software based on Windows system, easy to operate Chinese
interface, friendly and beautiful, powerful and diverse functions,
simple and convenient operation.

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